SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications

Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications

Feb 08, 2016

EMS 618-116 Adhesive.

EMS 618-116 Adhesive.

Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications.

EMS 618-116 is designed to cure in 30 minutes at 100°C or rapidly at elevated temperatures. EMS 618-116 forms high-strength, high-reliability conductive interconnects.

The EMS 618-116 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications.

For more information about the EMS 618-116 Room Temperature Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Jul 07, 2016 -

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America

Jan 25, 2016 -

Engineered Materials Systems receives IDTechEx award for printed electronics technology

Jan 25, 2016 -

Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist

Oct 19, 2017 -

Juki Automation Systems Awards Quantum Systems ‘Representative of the Year –Best Performance’

Oct 19, 2017 -

Logic PD to Exhibit Medical Market Successes at MD&M Minneapolis 2017

Oct 18, 2017 -

Horizon Sales Earns Juki Sales Awards

Oct 18, 2017 -

MarTec Receives Outstanding Achievement Award from Juki Automation Systems

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Oct 18, 2017 -

Keith Bryant to Present on Behalf of YXLON International at productronica

Oct 18, 2017 -

Metcal makes strategic move in industrial ingenuity – Learn more at productronica

Oct 18, 2017 -

Sono-Tek to Introduce New SelectaFlux-A System at productronica 2017

Oct 18, 2017 -

Aegis Software Brings “The Smarter Perspective” on Industry 4.0 MES Technology to Productronica

Oct 18, 2017 -

IPC Hand Soldering Competition Winner Crowned at IFTEC in Paris

See electronics manufacturing industry news »

Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications news release has been viewed 523 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications
Jetting Pump for Integration

Software for SMT