SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications

Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications

Feb 08, 2016

EMS 618-116 Adhesive.

EMS 618-116 Adhesive.

Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications.

EMS 618-116 is designed to cure in 30 minutes at 100°C or rapidly at elevated temperatures. EMS 618-116 forms high-strength, high-reliability conductive interconnects.

The EMS 618-116 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications.

For more information about the EMS 618-116 Room Temperature Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Jul 07, 2016 -

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America

Jan 25, 2016 -

Engineered Materials Systems receives IDTechEx award for printed electronics technology

Jan 25, 2016 -

Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications news release has been viewed 452 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications
TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit

Reflow Ovens thermal process improvement