SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist

Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist

Jan 25, 2016

DF-3010 Dry Film Negative Photoresist.

DF-3010 Dry Film Negative Photoresist.

Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-3010 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-3010 is available in other thickness formats from 5 to 50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3010 film is tougher (less brittle) than most negative photoresists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. It is hydrophobic in nature, providing for chemical and moisture resistance. DF-3010 is compatible with and can be used in contact with the EMS line of spin coatable photoresists.

DF-3010 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.

For more information about the DF-3010 negative photo resist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Jul 07, 2016 -

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America

Feb 08, 2016 -

Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications

Jan 25, 2016 -

Engineered Materials Systems receives IDTechEx award for printed electronics technology

Jul 23, 2017 -

PDR Americas Partners with Orr Marketing, Inc. in the Carolinas

Jul 23, 2017 -

Zuken Announces XJTAG DFT Assistant for CR-8000 PCB design suite

Jul 23, 2017 -

SMTA Welcomes New Board Members

Jul 23, 2017 -

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Jul 23, 2017 -

Senator Ron Johnson Discusses U.S. Policy Priorities in Townhall Discussion with IPC-member Company, VirTex MTI

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

See electronics manufacturing industry news »

Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist news release has been viewed 388 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces DF-3010 Dry Film Negative Photoresist
KIC SPS Smart SMT Reflow Oven Profiler

StikNPeel™ Rework Stencils