In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.
With topics ranging from vertical hole fill to BGA voiding, these amendments include updates that:
- Reintroduce the Space Shuttle symbol to show where there are different criteria in the J-STD-001FS, Space Applications Electronic Hardware Addendum to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies
- Revise the Class 2 requirements for vertical solder fill on plated through holes with less than 14 leads to include requirements when there is a connected internal thermal plane
- Eliminate requirements for BGA voiding for BGA components with noncollapsing balls
NOTE: The amendments are being sold in a downloadable format only.