Saki Debuts 3rd Generation 3D AOI Inspection Systems at NEPCON Japan Booth E17-46
Jan 11, 2016
Saki will also be demonstrating its 3D automated x-ray inspection system that provides 100% head-in-pillow detection. This unique, true 3D system takes up to 200 slices of a component and inspects and measures the solder joint structures, with on-the-fly reconstruction and volume measurements, for every solder joint, creating 3D data for the entire sample. The system perfectly separates the top and bottom sides of the PCB for extremely high resolution images and best-in-class Cpk and gage repeatability and reproducibility, which is especially needed for applications in the aerospace, medical, and automotive markets where reliability is critical.
"Saki has been the industry innovator that revolutionized 2D line-scan AOI over 21 years ago," said Kenji Nishida, Japan sales manager, Saki Corporation. "We offer a complete 3D line-up of SPI, AOI, and AXI and have over 15,000 systems installed globally. The entire 3D line-up shares the same software for easier programming and operation. Come talk to our technical experts at NEPCON Japan to discuss how we can meet your inspection needs and challenges."
NEPCON Japan is being held in Tokyo Big Sight from January 13-15, 2016. Visit Saki at booth E17-46 or for more information contact Saki at +81-3-5788-6280, email firstname.lastname@example.org, or visit our website at www.sakicorp.com.
Since its inception in 1994, Saki has led the way in the development of automatic recognition through robotic vision technology, applying ground-breaking image processing tools to solve inspection problems associated with printed circuit board assembly. Saki Corporation has headquarters in Tokyo, Japan with offices and sales and support centers around the world. Saki has Quality Management System JIS Q 9001:2008 and ISO 9001:2008 certifications.