SMT, PCB Electronics Industry News

NPL Electronics Interconnection Group Webinars 2016 Launched

Jan 08, 2016

Bob Willis organiser of the NPL Webinars 2016

Bob Willis organiser of the NPL Webinars 2016

NPL Electronics Interconnection Group Webinars 2016 Launched

We are very pleased to help organise the NPL monthly webinars which are free to join and provide support to the industry world wide

Testing Solder Mask for Assembly Process Compatibility
 Bob Willis
 Monday 18th January starting at 2.30pm UK Time

Solder mask or solder resist as it is often called, is often overlooked when specifying and procuring bare printed circuit boards. Most commonly it is specified as green, photo imagible and meets the requirements of IPC 840 but there is more to it than that. This webinar will highlight some of the most common assembly problems associated with solder mask and highlight key issues to be aware of during design and manufacture. The session will also highlight some of the tests conducted on solder mask in previous NPL projects along with the IPC standard requirements

Book your place Click Here https://attendee.gotowebinar.com/register/5473791466647566082

Topics Covered:
 Why are solder masks used?
 Solder mask materials
 Solder mask problems in production
 Test methods for solder masks

The webinar will run for between 45-60min with question and answer session. The webinars are limited to 100 delegates/companies

High Temperature Electronic Joining – How does HMP solder perform compared to new alternatives?
 Martin Wickham
 Thursday 17th March starting at 2.30pm UK Time

This webinar will summarise work undertake at NPL to better understand electrical interconnection materials which can offer an alternative to High Pb-based solders. The projects discussed will include those involving harsh environment applications. Subject areas covered will include use of sintered silvers and high temperature conductive adhesives for operation above 200oC for such applications as aerospace, oil and gas, and automotive.

During the webinar recent work conducted as part of the ELCOSINT project will be reviewed which focussed on high temperature electronics aiming to have a significant impact on energy efficiency and the environment. Over the last 3 years the project partners Microsemi, Gwent Electronic Materials (GEM) and National Physical Laboratory (NPL) have successfully developed materials specifically designed to offer an alternative for high Pb content materials to further increase the operating temperature of electronic assemblies. These materials will be suitable for operating at temperatures above 250oC utilising standard manufacturing processes which, until now, have been a road block for high temperature interconnects in, for example, SiC applications.

Book your place Click Here https://attendee.gotowebinar.com/register/1884717232754004737

Topics Covered:
 Requirements of high temperature application
 Alternative materials
 Reliability issues with existing materials
 Results and future work on high temperature alternatives

The webinar will run for between 45-60min with question and answer session. The webinars are limited to 100 delegates/companies

Impact of Surface Mount Rework on Reliability
 Martin Wickham & Bob Willis
 Wednesday 11 May starting at 2.30pm UK Time

Does rework impact the reliability of modern printed board assemblies? What is the weak link in the chain and how could reliability be assessed? There is a limited amount of data on the impact of rework on printed board assemblies, even though some industry sectors say they do not allow rework. The webinar will look at some of the results of testing on solder joints and the impact re-terminating components and the possible problems associated with mixing lead-free solder alloys.

Book your place Click Here https://attendee.gotowebinar.com/register/1168111628862733057

Topics Covered:
 Rework procedures
 Rework failures on solder joints, components and PCBs
 Reliability test results
 Difficulty in the assessment of reliably rework

The webinar will run for between 45-60min with question and answer session. The webinars are limited to 100 delegates/companies

How Good Are Conformal Coatings at Preventing Sn Whisker Failures?
 Martin Wickham
 Wednesday 20 July starting at 2.30pm UK Time

For the last two years, NPL and industrial partners have been investigating conformal coating of assemblies as a mitigation strategy for tin whiskers by using a specially designed test vehicle incorporating SM components. This webinar will provide details of the project including the test methodology employed with an update on results to date. Now the validity of the test vehicle has been proven, further work is planned and this is also be discussed.

Book your place Click Here https://attendee.gotowebinar.com/register/8077519663621158145

Topics Covered:
 Conformal coating types
 Coating coverage
 Methods of testing coatings
 Formation of tin whiskers
 How do coatings reduce failure?

The webinar will run for between 45-60min with question and answer session. The webinars are limited to 100 delegates/companies

 Development of Condensation Testing & Industry Benefits
 Chris Hunt
 Wednesday 14 September starting at 2.30pm UK Time

NPL have developed a new test method to control the rate of condensation on to printed board assemblies during environmental testing. The method provided considerable improvements on existing industry standard tests and the EI Group are currently running a multi partner project to refine the test and fine criteria.

This webinar will provide an overview of the test methods and some results from other NPL SIR assessment projects in Europe

Book your place Click Here https://attendee.gotowebinar.com/register/796849433116420865

Topics Covered:
 Review of existing test methods
 Disadvantages of industry procedures
 NPL condensation test benefits
 Results of selected production trials

The webinar will run for between 45-60min with question and answer session. The webinars are limited to 100 delegates/companies

Solder Joint & Cleanliness Reliability Assessment in Production (Sweden Project)
 Chris Hunt, Ling Zou & Bob Willis
 Wednesday 9 November starting at 2.30pm UK Time

This webinar will look at results of different production trials conducted on test boards produced on two production lines as part of a NPL supported project in Sweden. The tests conducted will look at a number of different soldering process and materials and the impact on solderability, solder joint formation, cleanliness and surface resistance. A special test board features QFN packages with SIR test coupons and other fine pitch and area array packages is being processed through no clean and cleaning processes

Book your place Click Here https://attendee.gotowebinar.com/register/7831351104790223617

Topics Covered:
Assembly process for clean and no clean
 Test board design
 Test board assessment
 Cleanliness results
 SIR test procedure

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Plan your engineering process improvement with a monthly online webinar

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Lead Free & Tin/Lead Wave Soldering Defect Guide to Download

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0201, 01005 & Smaller Soldering, Assembly & Defect Photo CD

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