SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Indium Corporation

Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016

Jan 05, 2016

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif.

AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.

Gold-based solder has a high melting point, ranging from 280°C to 1064°C (depending on the alloy), making it compatible with subsequent reflow processes. This alloy has the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.

Indium Corporation’s Pb-free and RoHS-compliant AuSn preforms are available in a variety of standard and custom-engineered designs.

Indium Corporation’s precision manufacturing processes and technologies ensure repeatable success in a production process. In addition, Indium Corporation partners with die-bonding equipment manufacturers to ensure that its preforms are engineered to work with equipment from assembly through reflow.

For more information about AuSn preforms, email, visit, or stop by Indium Corporation’s booth #311.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.

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Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016 news release has been viewed 314 times

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