SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Akrometrix LLC Debuts the AKM600P – FOWLP Panel Warpage Measurement System

Akrometrix LLC Debuts the AKM600P – FOWLP Panel Warpage Measurement System

Dec 02, 2015

AKM600P – FOWLP Panel Warpage Measurement System.

AKM600P – FOWLP Panel Warpage Measurement System.

Unique “Single Shot” full field of view for warpage measurement on FOWLP panels up to 600 x 600 mm

Akrometrix LLC, a leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced the company’s entry into the Fan Out Wafer Level Processing (FOWLP) market with an innovative, single shot full field of view warpage metrology system for panels up to 600 x 600 mm.

Scalable manufacturing technology is driving the industry’s need to move from wafer sized limitations in the FOWLP market to panel based manufacturing. This is a logical step to move beyond wafers to panel sized substrates, which have been used in the LCD industry for years.

Akrometrix’s AKM600P warpage measurement system enables customers to complete single shot warpage measurement of the entire panel and individual die on panels up to 600 x 600 mm simultaneously. The complete measurement and analysis of a panel of this size provides z-resolution down to 1.25 µm and takes less than two seconds to complete using the patented Shadow Moiré technology. Additionally, warpage measurements can be conducted at room temperature or up to 300°C for those needing thermal profiles.

“Akrometrix’s Shadow Moiré systems have become the industry standard for warpage measurement, especially at temperature,” noted Mayson Brooks, Akrometrix’s President and CEO. “With the emerging market for FOWLP in panel form, our technology is uniquely positioned to scale up to panel sized warpage measurements, sacrificing neither warpage resolution nor measurement acquisition time in moving from die size measurements to 600 x 600 mm measurements. The ability to measure both wafers and panels on the same equipment is the perfect ‘bridge’ tool as customers continue to do wafer processing while developing their panel technology.”

For more information about Akrometrix’s warpage metrology systems, please contact sales.akrometrix.com or visit www.akrometrix.com.


Akrometrix is the leader in thermal warpage and strain metrology for the front-end/back-end wafer, back-end packaging/assembly, panel and the PCB/component markets. The company provides both capital equipment and test services to measure warpage and strain in temperatures from -50°C to 300°C on virtually any substrate up to 600mm x 600mm, regardless of shape. Located in Atlanta, Georgia, Akrometrix has been serving customers worldwide for more than 20 years based on technology developed at Georgia Tech. For more information, contact Akrometrix at Sales@Akrometrix.com or visit www.Akrometrix.com.

Oct 16, 2017 -

Akrometrix Answers the Industry’s Demand for an Ultra-Fast Tabletop Warpage Metrology System Just in Time for productronica

Aug 30, 2017 -

Akrometrix to Participate in the SMTAI Spotlight 5 Panel Discussion: “Warpage Induced Defects and Component Warpage Limits”

Aug 14, 2017 -

Akrometrix Launches New Tabletop Shadow Moiré (TTSM) at SMTA International

Jun 29, 2017 -

Akrometrix Launches New Warpage Metrology System – the Tabletop Shadow Moiré (TTSM)

Feb 15, 2017 -

Akrometrix Wins a 2017 NPI Award for Its Next Generation AXP Shadow Moiré System at APEX

Jan 10, 2017 -

Akrometrix to Showcase Next-Generation AXP Shadow Moiré System at APEX

Oct 04, 2016 -

Akrometrix Announces Next-Generation AXP Shadow Moiré System

Sep 23, 2016 -

Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI

Sep 22, 2016 -

Akrometrix Announces New Schedule for Technical Presentations

May 05, 2016 -

Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology

14 more news from Akrometrix »

Oct 19, 2017 -

Juki Automation Systems Awards Quantum Systems ‘Representative of the Year –Best Performance’

Oct 19, 2017 -

Logic PD to Exhibit Medical Market Successes at MD&M Minneapolis 2017

Oct 18, 2017 -

Horizon Sales Earns Juki Sales Awards

Oct 18, 2017 -

MarTec Receives Outstanding Achievement Award from Juki Automation Systems

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Oct 18, 2017 -

Keith Bryant to Present on Behalf of YXLON International at productronica

Oct 18, 2017 -

Metcal makes strategic move in industrial ingenuity – Learn more at productronica

Oct 18, 2017 -

Sono-Tek to Introduce New SelectaFlux-A System at productronica 2017

Oct 18, 2017 -

Aegis Software Brings “The Smarter Perspective” on Industry 4.0 MES Technology to Productronica

Oct 18, 2017 -

IPC Hand Soldering Competition Winner Crowned at IFTEC in Paris

See electronics manufacturing industry news »

Akrometrix LLC Debuts the AKM600P – FOWLP Panel Warpage Measurement System news release has been viewed 889 times

  • SMTnet
  • »
  • Industry News
  • »
  • Akrometrix LLC Debuts the AKM600P – FOWLP Panel Warpage Measurement System
SMT in-printer dispensing

HeatShield Gel- thermal PCB shield during reflow