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Indium Corporation Wins Global Technology Award for InFORMS®

Dec 01, 2015

InFORMS® high-reliability solder preforms are revolutionary in their ability to provide uniform bondline thickness.

InFORMS® high-reliability solder preforms are revolutionary in their ability to provide uniform bondline thickness.

Indium Corporation was presented with the Global Technology Award for Best Products - Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.

InFORMS® are revolutionary in their ability to provide uniform bondline thickness. An uneven solder bondline thickness can cause stress at the thinner sections, leading to delamination and premature failure during the operational life of the module. The uniform bondline thickness created by InFORMS® prevents this stress.

InFORMS® also ensure high reliability by reducing voiding.

In testing, InFORMS® have shown to improve the reliability of the interconnect to at least 3,500 thermal cycles, which drastically exceeds the typical reliability specification of 1,500 passive thermal cycles for -55/+150 °C.

Sponsored by Global SMT & Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years.


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

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