Share Your Research at SMTA International 2016!

Nov 25, 2015

On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature. 

There are many benefits to participating!
  1. Make a contribution to our industry by sharing your work.
  2. Network with industry colleagues and showcase your company's position in the industry as an author and speaker,
  3. Receive a discount on your conference registration.
  4. Be eligible for $1,000 cash awards for the 'Best of Conference', 'Best of Proceedings', and 'Best International' papers. 
  5. $500 award for the best student paper.

Abstracts are due by February 12, 2016.

Submit Abstract »

Short course (1/2 day - 3.5 hours) proposals are also being solicited and should be submitted by the same deadline.

The Technical Committee is soliciting abstracts in the following categories: 

Advanced Packaging/Components: 

  • 2.5/3D Packaging and Integration
  • BGA/CSP
  • Biomedical Packaging
  • Component Storage
  • Connector Technology
  • Copper Pillars
  • Copper Wire Bonding
  • Diffusion Bonding
  • Embedded and Miniature Passives
  • Environmental Testing
  • Failure Analysis Techniques
  • Fine Pitch BGA
  • Flip Chip
  • High Temperature Packaging
  • Lead Finishes
  • Magnetic Soldering
  • MEMS and Sensors
  • Moisture Sensitive Devices (MSD)
  • Package on Package (PoP)
  • Photonics
  • Photovoltaics and Solar
  • Reliability
  • Silver Wire-bonding
  • Stacked Die
  • System in Package (SiP)
  • Through Silicon Vias (TSVs)
  • Tin Whiskers
  • Wafer Level Packaging (WLP)

Assembly: 

  • 01005/03015 Components/Assembly
  • 3D Board Assembly
  • Additive Manufacturing
  • SMT Adhesives
  • Alternate Solder Alloys
  • BGA/CSP Assembly
  • Bottom Terminated Components
  • Cavity Board Assembly
  • Cleaning, Conformal Coating and Potting
  • Connector Assembly to PCB
  • DFX/Design for Six Sigma
  • Direct Chip Attach to PCB (DCA)
  • Dispensing & Underfill
  • Epoxy Fluxes
  • Facility Layout
  • Halogen and Halogen-Free
  • Head on Pillow Defect/Warpage Induced Solder Joint Defects
  • High Melting Point Solder
  • Laser Soldering
  • Leadless Area Array Packages
  • Lead-Free Soldering/Reliability
  • Low Temperature Processing
  • Low Volume/Prototype
  • Non-Wet Open (NWO) Defects
  • Package-on-Package Assembly
  • Part Obsolescence
  • Placement
  • Printing
  • Reflow Soldering/ Wave Soldering
  • Rework and Repair of QFNs (01005, Leadless Components, PoP, Rework Reliability
  • Robotic Soldering
  • Selective Soldering
  • Solder Jetting
  • Solder Paste/Solder Voids in Joints
  • Solderless Interconnections
  • Supplier Engineering
  • Thermo Compression Bonding
  • Underfill/ Corner Glue/ Other Polymeric Reinforcements
  • Vapor Phase Reflow
  • Yield Improvement

Business/Supply Chain: 

  • Capacity Modeling
  • Conflict Minerals
  • Contract Manufacturing
  • Counterfeit Parts
  • Doing Business in Overseas
  • Environmental Issues
  • Lean Manufacturing
  • Onshoring
  • Operations Management
  • Part Obsolescence
  • RoHS/REACH Compliance
  • Supplier Management
  • Technology Roadmaps

Emerging Technologies: 

  • <= 0.3mm Pitch Area Array Technologies
  • 3D Circuits
  • 3D Printing & Design Rules
  • Advanced Packaging
  • Assembly to Flex Substrates
  • Assembly to Glass Substrates
  • Cavity Assembly
  • Consumer Applications
  • Embedded Active Technology
  • Embedded Passive Technology
  • Flexible Electronics
  • Jetting of Solder Pastes
  • LED Technology/Assembly/Reliability
  • MEMS/RF/MOEMS
  • Microsystems Packaging / Modular Microsystems
  • Nanomaterials
  • Nanotechnology, Materials, & Electronics
  • New Materials and Processes
  • Optoelectronics
  • Plastic 3D PCB to PCB Technology
  • Power or Thermal Management
  • Power Electronics
  • Printed Electronics Technology
  • Reliability of Nanodevices
  • Resin Reinforcement Solder Pastes
  • Sensors and Manufacturing
  • Smart Manufacturing Systems
  • Small Die Size Singulation
  • Solid State Lighting
  • Solar Technology
  • System in a Package
  • Thermal Interface Materials
  • Touch Screen Technologies
  • Virtual Prototyping
  • Wearable Electronics
  • Wireless Applications

Harsh Environment Applications
(Military, Aerospace, Automotive, Industrial, Oil & Gas):

  • Alternate Energy
  • Battery Prognostics
  • Components and Reliability
  • Copper Corrosion
  • COTS
  • High Lead Solder Replacement
  • High Temperature Electronics
  • Lead-free Issues
  • Non-Destructive Inspection
  • Micro-Computed Tomography
  • Multiphysics Modeling
  • Substrates and Finishes
  • Thermal Management
  • Tin Whiskers

PCB Technology: 

  • Bio-Compatible Substrates
  • Black Pad and Surface Finish Defects
  • Conductive Anodic Filament (CAF)
  • Creep Corrosion
  • Embedded Passive/Active Components
  • Halogen Free
  • HDI
  • High Power PCBs
  • Micro-vias (including filled/unfilled)
  • Moisture Sensitivity
  • New Laminate Materials
  • New Surface Finishes & Solderability
  • Pad Cratering
  • Soldermask
  • Substrate Reliability

Process Control: 

  • Acoustic Imaging (C-SAM)
  • Benefits of AOI & SPI
  • CIM
  • In-Circuit Test
  • Process Modeling
  • Software
  • Test Strategies
  • 2D/3D X-Ray

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