SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • YINCAE Advanced Materials Wins Global Technology Award at Productronica for World’s First Solder Joint Encapsulant

YINCAE Advanced Materials Wins Global Technology Award at Productronica for World’s First Solder Joint Encapsulant

Nov 18, 2015

November 18, 2015

Albany, NY – YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2015 Global Technology Award in the adhesives, coatings, and encapsulants category! This ceremony took place on Tuesday, November 10th at the Productronica Global Exhibition in Munich, Germany.

YINCAE Solder Joint Encapsulant was recognized as one of the products that made the greatest impact on the electronics industry in the years 2014 and 2015. YINCAE SJE replaces flux in the manufacturing process, and removes the need for underfill. After curing, the adhesive encases each individual solder ball, leaving only air in between the balls. Our product has been proven to have better reliability, better thermal cycling performance, and easy reworkability.

About Global Technology Awards

The Global Technology Awards are universally recognized as the most international industry award, attracting entries from Europe, USA and Asia. Each year the Global Technology Awards recognize the latest innovations in production equipment and materials for the EMS industry by a distinguished panel of industry experts.

About YINCAE Advanced Materials, LLC

Founded in 2005, and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronics materials used in electronic and optoelectronic devices. YINCAE products provide innovative solutions to support manufacturing processes from wafer level, to package level, to board level, and in final devices.

FOR ADDITIONAL INFORMATION CONTACT:

YINCAE Advanced Materials, LLC

19 Walker Way

Albany, NY  12205

Phone: (518) 452-2880

E-mail: info@yincae.com

The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Feb 14, 2018 -

Press Release: DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

Feb 14, 2018 -

Press Release: DA 90 Low Temperature Die Attach Adhesive Series Materials

Feb 14, 2018 -

Press Release: YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA

Feb 08, 2018 -

PRESS RELEASE: IPC APEX is 2 Weeks Away!

Jan 16, 2018 -

Press Release: YINCAE’S New Reflowable Underfill Material: SMT 160

Jan 16, 2018 -

Press Release: Low Temperature Reflowable Underfill Material: SMT 160L

Aug 08, 2017 -

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Aug 08, 2017 -

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Jun 13, 2017 -

SMT 158UL Highly Filled Room Temperature Underfill

Jun 06, 2017 -

SMT 88UL Super-Fast Flow Room Temperature Underfill

19 more news from YINCAE Advanced Materials, LLC. »

Feb 22, 2018 -

KIC demonstrates smart factory technologies with IPC CFX communication at APEX

Feb 22, 2018 -

MicroCare Offers Higher Performance Critical Cleaning Solutions at IPC APEX Booth #2909

Feb 22, 2018 -

Latest Conference Proceedings Now Available in SMTA Knowledge Base

Feb 22, 2018 -

Scienscope to Exhibit Flexible X-ray Component Reel Counter at productronica China

Feb 22, 2018 -

IPC Issues Position Paper on Priorities for an Ambitious EU Industrial Policy Strategy Supports skills gap closure, R&D incentives and strong IP protection

Feb 22, 2018 -

Data Logging: Intelligently and Efficiently

Feb 22, 2018 -

KDPOF Enables Seamless Optical Networks Integration

Feb 22, 2018 -

XJTAG Announces DFT Assistant for Zuken CR-8000 PCB design suite

Feb 21, 2018 -

Joseph Stockunas, Nordson Corporation Corporate VP, Appointed to SEMI Foundation Board of Trustees

Feb 21, 2018 -

VJ Electronix Hires Industry Expert to Continue Strengthening Global Sales and Services

See electronics manufacturing industry news »

YINCAE Advanced Materials Wins Global Technology Award at Productronica for World’s First Solder Joint Encapsulant news release has been viewed 659 times

  • SMTnet
  • »
  • Industry News
  • »
  • YINCAE Advanced Materials Wins Global Technology Award at Productronica for World’s First Solder Joint Encapsulant
PCB Rework / Repair Services

Fully automatic selective soldering stations