SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Indium Corporation Low-Voiding Solder Paste Helps Users Avoid the Void at Productronica 2015

Indium Corporation Low-Voiding Solder Paste Helps Users Avoid the Void at Productronica 2015

Nov 12, 2015

Indium8.9HF is specifically formulated to reduce or eliminate voiding for improved finished goods reliability. This paste is perfectly suited for a variety of applications, especially automotive assembly, due to its unique oxidation barrier technology.

Indium8.9HF is specifically formulated to reduce or eliminate voiding for improved finished goods reliability. This paste is perfectly suited for a variety of applications, especially automotive assembly, due to its unique oxidation barrier technology.

Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany. 

Indium8.9HF is specifically formulated to reduce or eliminate voiding for improved finished goods reliability. This paste is perfectly suited for a variety of applications, especially automotive assembly, due to its unique oxidation barrier technology.

Indium 8.9HF delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes potential defects.

In addition to outstanding print transfer and excellent response-to-pause, Indium8.9HF also provides excellent pin-in-paste solderability and hole-fill, while remaining stable at room temperature for up to 30 days. 

Indium8.9HF solder paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes. For more information about Indium8.9HF, email askus@indium.com, visit www.indium.com/productronica-germany-2015, or stop by Indium Corporation’s stand in hall A4 at booth #214.


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

Aug 30, 2016 -

Indium Corporation Experts to Present at IEMT–EMAP 2016

Aug 09, 2016 -

Indium Corporation Receives ON Semiconductor Award for “Perfect Quality” in 2015

Aug 03, 2016 -

Indium Corporation’s State-of-the-Art Recycling Process Delivers Credit for Solder Pot Dross and Contaminated Solder

Apr 26, 2016 -

Indium Corporation VP of Technology to Host Webtorials May 17 & 19

Apr 22, 2016 -

Indium Corporation Announces Karch as Regional Technical Manager for Germany, Austria and Switzerland

Apr 21, 2016 -

Indium Corporation Expert Presents at SMTA ICSR 2016

Apr 12, 2016 -

Indium Corporation's New Indium10.2HF Solder Paste Delivers Superior ICT Performance

Apr 07, 2016 -

Indium Corporation’s Lasky to Present at Joint SMTA and IMAPS Meeting

Apr 06, 2016 -

Indium Corporation's Indium8.9HF Solder Paste Series Technology Solution to Avoid the Void™

Mar 29, 2016 -

Indium Corporation Names Hults as Global Accounts Manager

240 more news from Indium Corporation »

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

See electronics manufacturing industry news »

Indium Corporation Low-Voiding Solder Paste Helps Users Avoid the Void at Productronica 2015 news release has been viewed 583 times

  • SMTnet
  • »
  • Industry News
  • »
  • Indium Corporation Low-Voiding Solder Paste Helps Users Avoid the Void at Productronica 2015
pcb components vacuum pick up

Universal GSM2 Feeders