SMT, PCB Electronics Industry News

SHENMAO Exhibits at MEPTEC/SEMI Symposium

Nov 03, 2015

Device integration and especially advanced packaging drive electronic systems personal mobility. Packaging technologies, manufacturing solutions, as well as the business models that support production must evolve to meet the challenges that this new era of mobile miniturization will produce. The first day will address the applications that drive the technology, the second will cover emerging technologies and a wrap-up panel discussion with the experts. Each day will feature a industry leading keynote speaker.

Find out more | Register

SHENMAO Solder Material, Solder Paste and Flux are made locally in the USA and with the same quality in 9 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability create highly reliable Solder Joints with optimum maximized Quality.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability, Sponsors MEPTEC SEMICONDUCTOR PACKAGING SYMPOSIUM November 30, 2017, E

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Nov 24, 2017 -

SHENMAO America, Inc. exhibits at local SMTA Exhibition at Bestronics, San Jose, CA Facility on November 29 - Introduces 2 new Solder paste formulations.

Sep 12, 2017 -

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 To Solve HoP Issues and Improve ICT Testability at SMTAI Exhibition

Jul 09, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

Jul 06, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Low Residue Liquid Flux SMF-B51

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

May 03, 2017 -

SHENMAO America, Inc. Exhibits Monday, May 8 Booth # 7

Mar 20, 2017 -

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux

Feb 01, 2017 -

SHENMAO America, Inc. Sponsors the SMTA Pan Pacific Microelectronics Symposium, February 6-9, 2017

25 more news from Shenmao Technology Inc. »

Dec 12, 2017 -

ECT’s Switch Probes: Cost-Efficient Solutions for Testing Electronic Assemblies

Dec 12, 2017 -

NEO Tech Design Team Wins Industry Award for Creative Solutions that Accelerate Time-to-Market

Dec 12, 2017 -

STI Has Accomplished AS9100D Certification

Dec 07, 2017 -

Nordson ASYMTEK Receives 2017 Global Technology Award for the NexJet NJ-8 Jetting System with ReadiSet 2-piece Jet Cartridge Award presented at Productronica 2017

Dec 07, 2017 -

Banner Engineering Completes Implementation of Optel Software on ASM Lines in Minneapolis and Suzhou (China)

Dec 06, 2017 -

Pan Pacific Microelectronics Symposium Program Finalized

Dec 05, 2017 -

Scienscope Promotes Don Jeka to National Sales & Marketing Manager for Its X-ray Division

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 05, 2017 -

Indium Corporation’s Vareha-Walsh to Present at International Electronic Recycling Congress (IERC) 2018

Dec 04, 2017 -

SCS to Discuss How Ultra-Thin Conformal Coatings Increase the Reliability of Critical Electronics during PennWell Webinar

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