SMT, PCB Electronics Industry News

SHENMAO Exhibits at MEPTEC/SEMI Symposium

Nov 03, 2015

Device integration and especially advanced packaging drive electronic systems personal mobility. Packaging technologies, manufacturing solutions, as well as the business models that support production must evolve to meet the challenges that this new era of mobile miniturization will produce. The first day will address the applications that drive the technology, the second will cover emerging technologies and a wrap-up panel discussion with the experts. Each day will feature a industry leading keynote speaker.

Find out more | Register

SHENMAO Solder Material, Solder Paste and Flux are made locally in the USA and with the same quality in 9 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability create highly reliable Solder Joints with optimum maximized Quality.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

Jun 17, 2018 -

New Low-Temperature Solder Paste from SHENMAO

Jun 03, 2018 -

New High Thermal & Impact Reliability Solder and Water Soluble Flux from SHENMAO

May 20, 2018 -

SHENMAO America to Participate in the eSMART Factory Conference

May 16, 2018 -

SHENMAO America to Show New Solder Alloy with High Thermal & Impact Reliability at SMTA Michigan Expo

Apr 25, 2018 -

SHENMAO Technology to Exhibit New Solder Alloy with High Thermal & Impact Reliability at SEMICON Southeast Asia

Apr 05, 2018 -

SHENMAO Technology will attend AutoTronics Taipei 2018

Jan 24, 2018 -

SHENMAO America to Solve Solder Paste Problems at APEX

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability, Sponsors MEPTEC SEMICONDUCTOR PACKAGING SYMPOSIUM November 30, 2017, E

Nov 28, 2017 -

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Nov 24, 2017 -

SHENMAO America, Inc. exhibits at local SMTA Exhibition at Bestronics, San Jose, CA Facility on November 29 - Introduces 2 new Solder paste formulations.

32 more news from Shenmao Technology Inc. »

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IPC’s PCB Technology Trends Study Underway, PCB Fabricator Survey Open Until July 13

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YXLON International to Host Three Open House Events at Its Lab One Facility

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ROSIN RESINS FOR SOLDERING SOLUTION

Jun 20, 2018 -

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KYZEN Sees Growth in Asia & Expands Marketing Support

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IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Jun 20, 2018 -

Inspection Services Labs in San Jose and Ohio Now Fully Equipped with Non-Destructive Testing Technology

Jun 20, 2018 -

VJ Electronix Promotes Frank Cosentino to Western Regional Sales Manager for the Americas

Jun 20, 2018 -

Scienscope Expands Partnership with Restronics

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