SMT, PCB Electronics Industry News

SHENMAO Exhibits at MEPTEC/SEMI Symposium

Nov 03, 2015

Device integration and especially advanced packaging drive electronic systems personal mobility. Packaging technologies, manufacturing solutions, as well as the business models that support production must evolve to meet the challenges that this new era of mobile miniturization will produce. The first day will address the applications that drive the technology, the second will cover emerging technologies and a wrap-up panel discussion with the experts. Each day will feature a industry leading keynote speaker.

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SHENMAO Solder Material, Solder Paste and Flux are made locally in the USA and with the same quality in 9 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability create highly reliable Solder Joints with optimum maximized Quality.

As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.

Sep 12, 2017 -

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 To Solve HoP Issues and Improve ICT Testability at SMTAI Exhibition

Jul 09, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Tacky Flux SMF-WC52 for Flip Chip Technology

Jul 06, 2017 -

SHENMAO Exhibits at SEMICON WEST July 11-13, 2017 Booth # 5716 Introduces New Low Residue Liquid Flux SMF-B51

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

May 03, 2017 -

SHENMAO America, Inc. Exhibits Monday, May 8 Booth # 7

Mar 20, 2017 -

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux

Feb 01, 2017 -

SHENMAO America, Inc. Sponsors the SMTA Pan Pacific Microelectronics Symposium, February 6-9, 2017

Jan 30, 2017 -

SHENMAO America, Inc. Exhibits February 14 - 16 at IPC APEX EXPO 2017 Booth # 1532 San Diego Convention Center

Oct 09, 2016 -

SHENMAO Technology presents a Poster at the 13 th. IWLPC At DoubleTree Airport Hotel by Hilton, San Jose, CA, USA

Oct 09, 2016 -

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

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Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

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