SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Shenmao Technology Inc.


SHENMAO America Exhibits at IWLPC October 13-14 in San Jose, CA

Oct 07, 2015

SHENMAO will exhibit at IWLPC October 13-14 in San Jose, CA, USA - Booth No. 505

SHENMAO, the World’s Major Solder Materials Provider, produces SMT Solder Paste, Low Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, Semiconductor Packaging Solder Spheres, Liquid/Paste Flux and PV Ribbon.

Registration to FREE expo: http://www.smta.org/expos

Registration to Conference and FREE expo: http://www.smta.org/expos/attendee_reg.cfm

For more information, please contact:

SHENMAO America, Inc. www.shenmao.com Tel: 1+408-943-1755 e-mail: usa@shenmao.com

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More News from Shenmao Technology Inc.

Mar 20, 2017 -

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux

Feb 01, 2017 -

SHENMAO America, Inc. Sponsors the SMTA Pan Pacific Microelectronics Symposium, February 6-9, 2017

Jan 30, 2017 -

SHENMAO America, Inc. Exhibits February 14 - 16 at IPC APEX EXPO 2017 Booth # 1532 San Diego Convention Center

Oct 09, 2016 -

SHENMAO Technology presents a Poster at the 13 th. IWLPC At DoubleTree Airport Hotel by Hilton, San Jose, CA, USA

Oct 09, 2016 -

SHENMAO America, Inc. Exhibits October 18-19 at IWLPC Introduces Semiconductor Packaging Materials

Sep 26, 2016 -

SHENMAO Introduces Room Temperature Storable RT Series Solder Paste at SMTAI Booth # 800 September 27-28, 2016

Sep 13, 2016 -

SHENMAO Exhibits at SMTA International at Donald E Stephens Convention Center, Rosemont, Il September 27-28, 2016 Booth # 800

Aug 23, 2016 -

SHENMAO Exhibits at SEMICON TAIWAN on September 7-9, 2016 Booth # J2922 Featuring BGA Solder Spheres and Bumping Paste

Jul 11, 2016 -

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux At Semicon West 2016 Booth # 6467 in San Francisco

Jul 07, 2016 -

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste At Semicon West 2016 Booth # 6467 in San Francisco

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SHENMAO America Exhibits at IWLPC October 13-14 in San Jose, CA news release has been viewed 302 times

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