SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • IPC Releases Revision D for IPC-6012, Qualification and Performance Specification for Rigid Printed Boards

IPC Releases Revision D for IPC-6012, Qualification and Performance Specification for Rigid Printed Boards

Sep 30, 2015

IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.

This D revision caps off a multi-year effort to update the core specifications in the IPC-6010 performance series, including IPC-6013C for flexible printed boards (published in December 2013) and IPC-6018B (published in November 2011) for high frequency (microwave) printed boards, with updated acceptance criteria for HDI/microvia structures. Moving forward, IPC will be able to retire the outdated IPC-6016 specification for HDI/microvia structures that was published in 1999.

The IPC-6012D revision represents a significant body of work by the IPC D-33a Rigid Printed Board Performance Task Group,” said John Perry, director of printed board standards and technologies at IPC. “A revision effort spanning five years, there are hardly any pages in the new revision where some level of content change or addition did not take place.”

There are many valuable additions to this revision, including updated requirements for dielectric removal, HASL solder pots, printed board edges, and markings and solder mask coverage. The most anticipated addition is for new microvia requirements for both the capture and target lands. Annular ring, plating to land separation, target land penetration and voiding in plated and copper filled structures are just some of the examples where the revision addresses microvia structures.

IPC-6012D and IPC-6012DS are available for purchase in the IPC book store.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Jun 21, 2018 -

IPC’s PCB Technology Trends Study Underway, PCB Fabricator Survey Open Until July 13

Jun 20, 2018 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Jun 17, 2018 -

IPC’s PCB Technology Trends Study Underway, OEM Survey Open Until July 6

Jun 17, 2018 -

IPC Hand Soldering Regional Qualification Competition Winner Crowned at SMT Hybrid Packaging 2018

Jun 06, 2018 -

IPC Welcomes U.S. Senate Defense Bill; Provision on Military Electronics Reflects IPC’s Priorities

Jun 04, 2018 -

Alternative Manufacturing, Inc. Earns Recertification as Qualified Manufacturer to IPC J-STD-001 AND IPC-A-610

Jun 04, 2018 -

Electronics and Textiles Come Together at IPC E-Textiles 2018

Jun 03, 2018 -

New IPC Report Shows Turnaround in North American PCB Market Size and Domestic Production 2018 Annual Report on the North American PCB Industry Released

May 29, 2018 -

North American PCB Industry Growth Continues but at a Slower Pace IPC Releases PCB Industry Results for April 2018

May 22, 2018 -

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

919 more news from Association Connecting Electronics Industries (IPC) »

Jun 21, 2018 -

New Applicator Guns from Techcon at Farnborough International Airshow

Jun 21, 2018 -

IPC’s PCB Technology Trends Study Underway, PCB Fabricator Survey Open Until July 13

Jun 21, 2018 -

YXLON International to Host Three Open House Events at Its Lab One Facility

Jun 21, 2018 -

ROSIN RESINS FOR SOLDERING SOLUTION

Jun 20, 2018 -

ECO-FRIENDLY MEETS HIGH-TECH – Product Launch at Nepcon Thailand

Jun 20, 2018 -

KYZEN Sees Growth in Asia & Expands Marketing Support

Jun 20, 2018 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Jun 20, 2018 -

Inspection Services Labs in San Jose and Ohio Now Fully Equipped with Non-Destructive Testing Technology

Jun 20, 2018 -

VJ Electronix Promotes Frank Cosentino to Western Regional Sales Manager for the Americas

Jun 20, 2018 -

Scienscope Expands Partnership with Restronics

See electronics manufacturing industry news »

IPC Releases Revision D for IPC-6012, Qualification and Performance Specification for Rigid Printed Boards news release has been viewed 4 times

  • SMTnet
  • »
  • Industry News
  • »
  • IPC Releases Revision D for IPC-6012, Qualification and Performance Specification for Rigid Printed Boards
SMT Equipment Service

Fluid Dispense Pump Integration