SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • IPC to Host Europe Forum: Innovation for Reliability in Essen, Germany

IPC to Host Europe Forum: Innovation for Reliability in Essen, Germany

Sep 16, 2015

IPC — Association Connecting Electronics Industries® will host this year’s Europe Forum: Innovation for Reliability in October in Essen, Germany. This three day event consists of two parts. The 9th Annual CALCE Tin Whiskers Symposium on 13 October, followed by the Technical Conference: Innovation for Reliability on 14-15 October.

This event will focus on critical issues in high reliability electronics for a variety of industries, including military-aerospace, automotive, industrial, and medical. Attendees of the event will be able to connect with a business leaders from top European organizations, and focus on innovations in materials, methodologies, and testing.

“The IPC Europe Forum is the premier place to discuss and learn about the newest innovations in the manufacturing of high reliability products,” said Sanjay Huprikar, vice president of member success at IPC. “From breakthroughs in packaging and future interconnection technologies, to the latest developments in achieving electrochemical robustness, this event provides a forum for forward-looking discussion and growth that will benefit the electronics industry.”

There is still time to register for the IPC Europe Forum: Innovation for Reliability. For more information, visit www,ipc.org.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Jul 17, 2017 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2018 Deadline for technical conference paper abstracts extended to: July 21, 2017

Jul 16, 2017 -

IPC Invites Industry Members to Participate on IPC European Standards Steering Committee

Jul 05, 2017 -

North American PCB Business Weakens but Book-to-Bill Ratio Remains Positive

Jun 29, 2017 -

IPC Invites Industry Leaders to Participate in New Global Data Service Pulse of the Electronics Industry to provide insight on health of industry

Jun 20, 2017 -

Zentech Manufacturing, Inc. First to Recertify for IPC Qualified Manufacturers Listing

Jun 14, 2017 -

IPC Submits Comments to Trump Administration Regarding Modernization of NAFTA

Jun 07, 2017 -

IPC Hand Soldering Competition Winner Crowned at SMT Hybrid Packaging 2017

Jun 01, 2017 -

North American PCB Order Growth Pushes Book-to-Bill Ratio Higher

May 16, 2017 -

IPC Report Details How PCB Manufacturers Meet Current and Future Technology Demands

May 15, 2017 -

Taiwan Union Technology Corporation Receives the First IPC-4101 Qualified Products Listing Certification

836 more news from Association Connecting Electronics Industries (IPC) »

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jul 19, 2017 -

COT Reduces Prices on SMT Nozzles & Consumables

Jul 19, 2017 -

Cogiscan Partners with iBASEt for Automated Electronics Assembly

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

See electronics manufacturing industry news »

IPC to Host Europe Forum: Innovation for Reliability in Essen, Germany news release has been viewed 441 times

  • SMTnet
  • »
  • Industry News
  • »
  • IPC to Host Europe Forum: Innovation for Reliability in Essen, Germany
Used PCB Equipment - AdoptSMT

KIC SPS Smart SMT Reflow Oven Profiler