SMT, PCB Electronics Industry News

Microtronic to Exhibit at the IMAPS EMPC in Germany

Sep 03, 2015

The Sonix ECHO™ Ultrasonic Flaw Detector.

The Sonix ECHO™ Ultrasonic Flaw Detector.

The Akrometrix TherMoiré AXP.

The Akrometrix TherMoiré AXP.

Microtronic GmbH, a leading sales specialist of microelectronics, today announced plans to exhibit at the 20th European Microelectronics and Packaging Conference & Exhibition (EMPC), scheduled to take place Sept. 14-16, 2015 in Friedrichshafen, Germany. Company representative will demonstrate the Microtronic LBT-210, Akrometrix TherMoiré AXP and Sonix ECHO™ as well as specialty solders from AIM.

Microtronic’s LBT-210 automatic and PC-controlled solderability tester is a revolutionary system that meets today’s current industry challenges. The system is operated by using solder paste and a temperature profile. A component is placed on printed solder paste and heated through the same temperature profile that is used in production. All force parameters and values during the heating cycle are monitored and saved. This is the only known existing method of simulating and qualifying the solder profile of an in-line production solder furnace in conjunction with different solder pastes and components.

Of course, it also can measure using the common methods with a solder bath or a solder globule. All industry standards including IPC, IES, NF, MIL and JEDEC are supported.

The Akrometrix TherMoiré AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré AXP captures a complete history of a sample's behavior during a user-defined thermal profile.

The Sonix ECHO™ Ultrasonic Flaw Detector is an industry-leading scanning acoustic microscope that provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.

Microtronic also will showcase specialty solders from AIM. For more information about Microtronic, visit

Microtronic was founded in 1981 and is based near Munich, Germany. With 30 years’ experience, we are the microelectronics leaders in Europe and offer a wide range of products and services to the microelectronics industries. We run regular training courses on various topics through in-house training or can arrange for specific employee training courses on request to suit your needs.

Our customers include companies who require added solderability test, ultrasonic microscopes, circuit board repair systems, welding systems, solders and solder pastes. We offer centralised pricing to our customers with the added benefit of unparalleled delivery times from our centralized European warehouses.

For more information, please visit

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