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Assembly Challenges of Small Packages - A Tech Symposium Presented by Industry Experts

Sep 01, 2015

Please join BEST for our 2015 Tech Symposium on the Assembly Challenges of Small Packages. Increase your understanding of the challenges involved in small footprint device assembly. 

We are excited to announce that our keynote speaker is Ronald C. Lasky, Ph.D. Ron is a PE with Indium Co. and Thayer School of Engineering at Dartmouth College. He will speak on how to properly run a design of experiments. This session alone will be worth your time invested! 

Additional topics and industry speakers will include:

  • Printing Process Development & Characterization of 0.4mm & Smaller Packages - Chrys Shea, Shea Engineering
  • Hand Soldering Techniques for Small Packages - Paul Wood, Metcal
  • Jetting for Prototyping & Small Packages - Nico Coenen, MyData
  • SPI Measurements for Small Packages -Joseph Kim, Koh Young

A buffet style luncheon including appetizers, salads, pastas and desserts are included.  We will have a friendly bocce ball tournament for those who would like to participate. So bring your A game! All are invited to hang around for the happy hour gathering immediately following the event. 

Register NOW - Seating is limited!  

SPECIAL BONUS - Register by Friday, September 4th and your name will be included in a raffle for CASH PRIZES on the day of the event.

When - October 1, 2015, 8:30am - 3:00pm

Where - South Barrington, IL 60010

Cost - $100/person

Got Questions?  

Please Contact 

Laura Ripoli 

BEST Inc. 

(847)-797-9250

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