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FCT Assembly to Showcase Comprehensive Product Line and have Major Presence at SMTA International

Sep 01, 2015

NanoSlic Coated Stencil

NanoSlic Coated Stencil

FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of products at SMTA International 2015 (www.smta.org/smtai/), as well as take part in the conference program and live process demonstrations on the show floor. 

From booth # 313 over September 29 and 30, the FCT exhibit will play host to the company’s stencil products, solder materials and NanoSlic™ stencil coatings.  At its foundation, the company is a chemistry formulation expert and this know-how has informed the development of some major industry breakthroughs, which show delegates are invited to discuss with the FCT team.

A major highlight of the FCT exhibit is its market-leading stencil coating, NanoSlic.  The revolutionary product has quickly emerged as the premiere coating technology for improved solder paste transfer efficiency, reduced underscreen cleaning requirements and overall printing yield improvements.  Visitors can learn more about NanoSlic’s process advantages and also see a NanoSlic-coated Fine Line stencil in action at the “Inspection Experience”, where live printing and inspection of ultra-fine pitch deposits will take place throughout the two days of the SMTA International exhibit.  Located at the show floor entrance, the Inspection Experience’s goal is to guide attendees through the printing, reflow and inspection processes and analyze common print and reflow challenges.

In addition to its show floor presence, FCT will also participate in the event’s conference program, during which findings from its latest development project -- a new flux formulation – will be shared.  Tony Lentz, FCT Assembly Field Application Engineer, will present a paper entitled “Formulation of a New Liquid Flux for High Temperature Soldering” as part of the “The How's and Why's of Fluxes in Electronics Assembly” session set to take place on September 29th from 4:00 to 5:30 p.m. The paper underscores the need for fluxes that can accommodate thermally demanding applications where long contact times and soldering temperatures of up to 290°C are the norm, allowing for good hole fill and minimizing bridging and other defects.

For more information or to schedule an appointment, send an e-mail to jglanzer@fctassembly.com. 

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