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  • MIRTEC TO DEMONSTRATE THE LATEST ADVANCEMENTS IN THEIR AWARD WINNING 3D AOI AND SPI SYSTEMS AT SMTAI

MIRTEC TO DEMONSTRATE THE LATEST ADVANCEMENTS IN THEIR AWARD WINNING 3D AOI AND SPI SYSTEMS AT SMTAI

Aug 24, 2015

MS-11E 3D In-Line SPI Machine.

MS-11E 3D In-Line SPI Machine.

MIRTEC, “The Global Leader in Inspection Technology,” announces that it will exhibit in Booth #407 at SMTA International, scheduled to take place Sep. 29-30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will showcase the latest advancement MIRTEC’s award-winning 3D AOI and SPI systems during the two-day event.

We at MIRTEC are extremely excited to present what is unquestionably the inspection industry’s most technologically advanced AOI system at this year’s SMTAI event,” stated Brian D’Amico, president of MIRTEC’s North American Sales and Service Division. The ALL NEW MV-6 OMNI 3D In-Line AOI Machine is configured with MIRTEC’s exclusive OMNI-VISION® 3D inspection technology which combines the award-winning 15 Mega Pixel CoaXPress Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system in a newly designed cost-effective platform.

OMNI-VISION® 3D Inspection Technology

MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with the company’s complete product range of 3D inspection systems. MIRTEC’s Digital Multi-Frequency Quad Moiré Technology provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured, the new MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. There is little doubt that this new technology will set the standard by which all other inspection equipment will be measured.

Also on display, MIRTEC’s ALL NEW MS-11E 3D In-Line SPI Machine is configured with MIRTEC’s exclusive 15MP CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates.

The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.

MIRTEC has earned a solid reputation in the electronics manufacturing industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” added D’Amico. “We look forward to welcoming visitors to our booth during the two-day event.”


MIRTEC is a leading global supplier of automated inspection systems to the Electronics Manufacturing Industry. For further information, please visit www.mirtec.com.

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