Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.
EMS 561-403 is designed to be used in a modified ribbon stringer. The material will snap cure and fixture ribbons in seconds at 180°C with enough strength to withstand module manufacturing processes until the adhesive cure is completed during the encapsulant lamination process. EMS 561-403 can be dispensed by time-pressure, auger or jetting. The adhesive is more stress absorbing than solder to withstand the rigors of thermal cycling and processes at lower temperatures than solder. EMS 561-403 is more than 50 percent less expensive than pure silver filled conductive adhesives.
For more information about EMS Low Cost Conductive Adhesives or to learn how the company can define, develop and create an engineered material solution that is right for your company, visit the tabletop display at the conference or visit www.emsadhesives.com.
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.