SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


IPC Issues Technical Conference Participation Call for IPC APEX EXPO 2016

Aug 23, 2015

Deadline for technical conference paper abstracts extended to: September 14, 2015

IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2016 at the Las Vegas Convention Center in Las Vegas. The technical conference will be held March 15-17, 2016. The deadline for technical conference paper abstracts has been extended to September 14,, 2015.

The world’s premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best Paper.

Expert papers and presentations are being sought on design, materials, assembly, processes and equipment in the following areas:

  • Automation in Electronics Manufacturing

  • Adhesives

  • Advanced Technology

  • Area Array/Flip Chip/0201 Metric

  • Assembly and Rework Processes

  • BGA/CSP Packaging

  • Black Pad and Other Board Related Defect Issues

  • BTC/QFN/LGA Components

  • Business & Supply Chain Issues

  • Cleaning

  • Conformal Coatings

  • Corrosion

  • Counterfeit Electronics

  • Design

  • Electromigration

  • Embedded Passive & Active Devices

  • Environmental Compliance

  • Lean Six Sigma

  • LED Manufacturing

  • Failure Analysis

  • Flexible Circuitry

  • HDI Technologies

  • Electronics Manufacturing Services

  • Head-on-Pillow

  • Board and Component Warpage

  • High Speed, High Frequency & Signal Integrity

  • Lead-Free Fabrication, Assembly & Reliability

  • Miniaturization Nanotechnology Optoelectronics

  • Packaging & Components

  • PCB and Component Storage & Handling Performance

  • Quality & Reliability

  • Photovoltaics

  • PoP (Package-on-Package)

  • Printed Electronics

  • PCB Fabrication

  • Reshoring

  • RFID Circuitry

  • Robotics

  • Soldering

  • Surface Finishes

  • Test, Inspection & AOI

  • Tin Whiskers

  • 2.5-D/3-D Component Packaging

  • Underfills

  • Via Plugging & Other Protection

  • Wearables

A 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results.

To submit an abstract for the technical conference, visit www.IPCAPEXEXPO.org/CFP.

For more information about conference papers and presentations, contact Jasbir Bath, IPC conference director, at JasbirBath@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
 

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

Mar 27, 2017 -

IPC Membership Reaches Significant Milestone IPC membership is now more than 4,000 member-sites strong

Mar 23, 2017 -

IPC Announces Honorees of Government IMPACT Award

Mar 14, 2017 -

IPC Global Marketplace Delivers Intelligent Search Technology

Mar 09, 2017 -

IPC Hand Soldering Competition to Heat Up SMT Hybrid Packaging 2017

Mar 07, 2017 -

Electronics Industry Leaders to Gather in DC in May to Advocate for Pro-Business Policies

Mar 06, 2017 -

IPC Issues Call for Participation for IPC APEX EXPO 2018

Mar 06, 2017 -

Gary Ferrari, FTG Circuits, Earns Dieter Bergman IPC Fellowship Award Award honors IPC members who have exhibited ongoing leadership

Mar 01, 2017 -

IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO

Mar 01, 2017 -

Electronics Industry Experiences Technology’s Turning Point at IPC APEX EXPO 2017

Feb 28, 2017 -

IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO

(814) more news from Association Connecting Electronics Industries (IPC)

IPC Issues Technical Conference Participation Call for IPC APEX EXPO 2016 news release has been viewed 438 times

SMT Services - STI Electronics

Reflow Ovens thermal process improvement