SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


IPC Issues Technical Conference Participation Call for IPC APEX EXPO 2016

Aug 23, 2015

Deadline for technical conference paper abstracts extended to: September 14, 2015

IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2016 at the Las Vegas Convention Center in Las Vegas. The technical conference will be held March 15-17, 2016. The deadline for technical conference paper abstracts has been extended to September 14,, 2015.

The world’s premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best Paper.

Expert papers and presentations are being sought on design, materials, assembly, processes and equipment in the following areas:

  • Automation in Electronics Manufacturing

  • Adhesives

  • Advanced Technology

  • Area Array/Flip Chip/0201 Metric

  • Assembly and Rework Processes

  • BGA/CSP Packaging

  • Black Pad and Other Board Related Defect Issues

  • BTC/QFN/LGA Components

  • Business & Supply Chain Issues

  • Cleaning

  • Conformal Coatings

  • Corrosion

  • Counterfeit Electronics

  • Design

  • Electromigration

  • Embedded Passive & Active Devices

  • Environmental Compliance

  • Lean Six Sigma

  • LED Manufacturing

  • Failure Analysis

  • Flexible Circuitry

  • HDI Technologies

  • Electronics Manufacturing Services

  • Head-on-Pillow

  • Board and Component Warpage

  • High Speed, High Frequency & Signal Integrity

  • Lead-Free Fabrication, Assembly & Reliability

  • Miniaturization Nanotechnology Optoelectronics

  • Packaging & Components

  • PCB and Component Storage & Handling Performance

  • Quality & Reliability

  • Photovoltaics

  • PoP (Package-on-Package)

  • Printed Electronics

  • PCB Fabrication

  • Reshoring

  • RFID Circuitry

  • Robotics

  • Soldering

  • Surface Finishes

  • Test, Inspection & AOI

  • Tin Whiskers

  • 2.5-D/3-D Component Packaging

  • Underfills

  • Via Plugging & Other Protection

  • Wearables

A 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results.

To submit an abstract for the technical conference, visit www.IPCAPEXEXPO.org/CFP.

For more information about conference papers and presentations, contact Jasbir Bath, IPC conference director, at JasbirBath@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
 

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

May 16, 2017 -

IPC Report Details How PCB Manufacturers Meet Current and Future Technology Demands

May 15, 2017 -

Taiwan Union Technology Corporation Receives the First IPC-4101 Qualified Products Listing Certification

May 15, 2017 -

IPC to Host Fourth Annual Reliability Forum in Germany

May 04, 2017 -

Electronics Industry Leaders Meet with Members of Congress and Leaders of Trump Administration Executives urge policymakers to support pro-manufacturing policies

May 04, 2017 -

IPC Welcomes New Senior Director of Learning and Professional Development

May 03, 2017 -

North American PCB Order Growth Boosts Book-to-Bill Ratio

May 02, 2017 -

IPC Welcomes New White House Office on Trade and Manufacturing Policy

Apr 27, 2017 -

IPC’s U.S. Skills Gap Study Reveals Skills and Qualifications in Short Supply

Apr 22, 2017 -

Congresswoman Discusses U.S. Policy Priorities with IPC Member-company, TTM Technologies

Apr 13, 2017 -

Congressman Discusses U.S. Policy Priorities with Staff at IPC Member-company, VirTex

(829) more news from Association Connecting Electronics Industries (IPC)

IPC Issues Technical Conference Participation Call for IPC APEX EXPO 2016 news release has been viewed 474 times

SMT in-printer dispensing

 Reflow System