SMT, PCB Electronics Industry News

Future of High Temperature Interconnection FREE Webinar

Aug 10, 2015

Materials suitable for operating above with standard manufacturing processes

Materials suitable for operating above with standard manufacturing processes

Future of High Temperature Interconnection

The ELCOSINT collaborative R&D project has focussed on high temperature electronics aiming to have a significant impact on energy efficiency and the environment. Over the last 3 years the project partners Microsemi, Gwent Electronic Materials (GEM) and National Physical Laboratory (NPL) have successfully developed materials specifically designed to offer an alternative for high Pb content materials to further increase the operating temperature of electronic assemblies. The webinar will be held in the 16th September.

These materials will be suitable for operating at temperatures above 250oC utilising standard manufacturing processes which until now have been a road block for high temperature interconnects in, for example, SiC applications. The presentation will cover the material development, product demonstrators, testing and final results See https://attendee.gotowebinar.com/register/8980309965588835586

Jul 28, 2017 -

PowerPoint presentations on Conventional & SMT Assembly to Download at Bobwillis.co.uk

May 21, 2017 -

Cleaning & Contamination Defects Photo CD-ROM

Apr 13, 2017 -

Plan your engineering process improvement with a monthly online webinar

Mar 22, 2017 -

Surface Mount Assembly & Defect Photo CD

Mar 08, 2017 -

Lead Free & Tin/Lead Wave Soldering Defect Guide to Download

Mar 06, 2017 -

0201, 01005 & Smaller Soldering, Assembly & Defect Photo CD

Mar 06, 2017 -

Archive Webinar Recordings on Soldering, PCB Assembly & Inspection

Mar 06, 2017 -

Hands on Master Class Series from Bob Willis

Feb 20, 2017 -

SMT and Conventional Photo CD ROM

Feb 11, 2017 -

Join Assembly Soldering Inspection Defects LinkedIn Group

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Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

Aug 16, 2017 -

COT Increases Manufacturing Capability with New DMG Horizontal Milling Centers

Aug 16, 2017 -

High-Performance 3D AOI from Viscom at SMTAI

Aug 16, 2017 -

Innovative Bench-top Soldering Equipment from Metcal at SMTAI

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ADLINK Introduces MVP-6010/6020 Series of Expandable Fanless Embedded Computers with Four Expansion Slots

Aug 16, 2017 -

SMTA Capital Expo to Feature Essemtec Fox Pick and Place System

Aug 16, 2017 -

All-in-One Low-cost, Scalable Functional test, In-System Programming, Boundary Scan / JTAG, In-Circuit Test System from Acculogic Visit Booth #133 at SMTA International

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