Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, now carries the MALCOM RDT-250C Reflow Simulator. The system can reproduce the temperature profile of a reflow oven while allowing operators to observe the melting state of solder paste and record the process.
The local matrix control system of the upper heater enables reflow soldering of the PCB in which the thermal capacity is balanced with the best heating temperature. Low power consumption provides excellent cost/performance benefits. Additionally, the RDT-250C can accommodate full size PCB boards for testing (250 x 330mm).
Each heating stage sets the temperature as well as the time. This makes it possible to change the time that keeps the reflow peak temperature free. The operator can observe the state of soldering through wide glass windows from the rear of the unit. An optional video camera capture system can be purchased to record the reflow process with profiles.
The system reproduces nearly the same conditions as an actual reflow oven by using the hot air of the upper-heater and the extreme infrared radiation of the lower heater together.
The MALCOM RDT-250C can heat in N2 atmospheres and control the N2 concentration with the O2 Oxygen Analyzer, OAS-1, and N2 flow adjustable function (OAS-1 is optional). For more information, contact Michelle Ogihara at email@example.com or visit www.seikausa.com.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.