Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.
The world of semiconductor packaging has never been more diverse or more complex. Join leading experts to discuss solutions to current and emerging challenges in assembly processes, materials, and reliability, as well as packaging technology advances.
This event will cover advanced topics including wafer bumping, flip-chip, TSVs, 3D assembly, wire-bonded packages, and MEMS devices.
Early registration ends on Aug. 21. To register for the event, visit www.imaps.org/asp.
Upstate New York is now a major hub for semiconductor fabrication and assembly, and is a beautiful and exciting location at the forefront of major technology advances and electronics industry growth.
IMAPS is the world’s largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.