SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist

Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist

Jun 17, 2015

DF-3005 Dry Film Negative Photo Resis.

DF-3005 Dry Film Negative Photo Resis.

Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and IC cooling applications, is pleased to introduce the DF-3005 Dry Film Negative Photo Resist for use in micro-electromechanical systems (MEMS) and wafer level packaging applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

DF-3005 is available in other thickness formats from 5-50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-3005 film is tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 158°C (By DMA Tan Delta) and a moderate modulus of 3.5 GPa at 25°C. It is hydrophobic in nature providing for chemical and moisture resistance. DF-3005 is compatible with and can be used in contact with the EMS line of spin coatable photoresists.

DF-3005 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.

For more information about the DF-3005 Dry Film Negative Photo Resist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

Sep 13, 2017 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 10, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Apr 22, 2017 -

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Mar 20, 2017 -

Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Mar 14, 2017 -

Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Jan 09, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Nov 14, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

48 more news from Engineered Materials Systems, Inc. »

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

Sep 19, 2017 -

ADLINK Technology Showcasing Latest Rugged Embedded Railway Solutions at Major European Railway Exhibitions TRAKO, Expo Ferroviaria and Nordic Rail

Sep 18, 2017 -

Seica Inc. participation at SMTAi Schaumburg, Illinois Booth # 315 New Frontiers of Testing -

Sep 18, 2017 -

ACE electronics invests in high-quality 3D inspection

Sep 18, 2017 -

Rework and Professional Soldering from Ersa SMTA Guadalajara Expo

See electronics manufacturing industry news »

Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist news release has been viewed 632 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist
TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit

Universal GSM2 Feeders