The SMTA International conference includes focused technical tracks covering Advanced Packaging Technology, Evolving Technologies, Lean Initiatives, Flux, Solder, Adhesives, Harsh Environment Applications, Inspection Technologies, Lead-Free Soldering Technology, Manufacturing Excellence, and Substrates/PCB Technology. Technical sessions will be held on Monday through Thursday. Tutorials are half-day educational courses offered on Sunday, Monday, and Thursday. Thursday’s tutorial on “LED, BGA, and QFN Assembly and Inspection” is free for SMTA and IPC members who register in advance.
Informative and focused symposia make up part of the technical conference and include the Evolving Technologies Summit, Harsh Environments Symposium, and Lead-Free Soldering Technology Symposium.
IPC will once again co-locate its Fall Standards Development Committee Meetings during SMTA International. This landmark collaborative effort by both associations has proven to benefit the electronics manufacturing industry as a whole.
Over 160 supplier companies will display equipment, materials, and services at the Electronics Exhibition, which will be held Tuesday and Wednesday, September 29 - 30. Attendees are invited to join Tech Tours to get an inside look at the latest in placement equipment and inspection technology. Free lunch will also be provided both days on the show floor.
Many additional events at SMTA International are free to all attendees including the L3 Series of Complimentary Sessions, SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience, Women’s Leadership Connection and Robotics Alley.First time attendees can take an extra 10% off conference registration. The Early Bird registration deadline is August 28, 2015.
For full details and to register for SMTA International, visit http://www.smta.org/smtai or contact SMTA administrator JoAnn Stromberg: 952-920-7682 or email@example.com.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.