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Nordson DAGE to Launch New 4800 Wafer Level Bondtester at SEMICON West

Jun 11, 2015

New 4800 Wafer Level Bondtester.

New 4800 Wafer Level Bondtester.

  • Advanced automated wafer testing from the market leader in bondtesting

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #5744 at SEMICON West 2015, scheduled to take place July 14-16, 2015 at the Moscone Center in San Francisco. Nordson DAGE will present the 4800 wafer level Bondtester for the first time in North America.

The Nordson DAGE 4800 Bondtester is at the forefront of wafer testing technology, developed for testing wafers from 200mm up to 450mm. Intuitive and intelligent Nordson DAGE Paragon™ software provides the ultimate flexibility for the creation and mapping of wafers, enabling quick and precise setup of test patterns. The virtual images for each test pattern enable easy editing. 

Nordson DAGE also will highlight its award-winning 4000Plus Bondtester Camera Assist Automation System, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages. Additionally, Nordson DAGE’s X-Plane™ and CT options will be demonstrated at the show.  X-Plane™ uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a printed circuit board assembly (PCBA) without the need to cut or destroy the board.

Nordson DAGE’s XM8000 Wafer Metrology Platform provides an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. It provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay and critical dimensions. More information about this system can be found in Booth # 1413.

For more information about Nordson DAGE, meet with their Test and Inspection experts at SEMICON West or visit www.nordsondage.com.


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit www.nordsondage.com.

Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.

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