SMT, PCB Electronics Industry News

More Pin In Hole Refolw Desing and QC from Bob Willis

May 24, 2015

Pin in Paste PCB prior to reflow

Pin in Paste PCB prior to reflow

Low & High Temperature Intrusive Reflow - Getting the Best Yields
Date:Wednesday, July 15, 2015
14.30 UK Time

Register online http://www.bobwillisonline.com/training_detail.asp?WorkshopID=129

Surface Mount Technology (SMT) is part of mainstream electronic assembly with virtually all market sectors benefiting from the use of SMT. One problem that has always proved an issue to design and process engineers is the use of existing through hole components where no direct equivalent SMT parts are available. Hence the interest in Pin in paste, intrusive reflow or multi spot soldering, regardless of the name it’s a perfect option to eliminate the wave and selective soldering with minimal cost

Selective soldering can provide excellent results but requires capital equipment investment. This method of soldering all surface mount and through hole components in a single operation is Pin-In-Hole-Reflow which simplifies the manufacturing process

Topics include:
PCB Design and Component Requirements
Stencil Aperture Calculations
Stencil Design Rules Placement
Options Manual and Automatic
Reflow Soldering with Convection, Vapour Phase & laser
Inspection Requirements
Practical Implication issues
Process Defects
Reliability of through hole joints

After each webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session. A copy of the slides presented on the webinar are sent to delegates after the session

May 21, 2017 -

Cleaning & Contamination Defects Photo CD-ROM

Apr 13, 2017 -

Plan your engineering process improvement with a monthly online webinar

Mar 22, 2017 -

Surface Mount Assembly & Defect Photo CD

Mar 08, 2017 -

Lead Free & Tin/Lead Wave Soldering Defect Guide to Download

Mar 06, 2017 -

0201, 01005 & Smaller Soldering, Assembly & Defect Photo CD

Mar 06, 2017 -

Archive Webinar Recordings on Soldering, PCB Assembly & Inspection

Mar 06, 2017 -

Hands on Master Class Series from Bob Willis

Feb 20, 2017 -

SMT and Conventional Photo CD ROM

Feb 11, 2017 -

Join Assembly Soldering Inspection Defects LinkedIn Group

Feb 05, 2017 -

Solder Ball Elimination – In Wave, Selective & Reflow Webinar

67 more news from ASKbobwillis.com »

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jul 19, 2017 -

COT Reduces Prices on SMT Nozzles & Consumables

Jul 19, 2017 -

Cogiscan Partners with iBASEt for Automated Electronics Assembly

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

See electronics manufacturing industry news »

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