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  • SMTA Capital Chapter to Host Second Meeting of the Year on May 28th at NTS Baltimore on “Failure Analysis Process for Printed Board Assemblies” by John M. Radman

SMTA Capital Chapter to Host Second Meeting of the Year on May 28th at NTS Baltimore on “Failure Analysis Process for Printed Board Assemblies” by John M. Radman

May 18, 2015

John M. Radman, Senior Applications Engineer, NTS Baltimore.

John M. Radman, Senior Applications Engineer, NTS Baltimore.

The SMTA Capital Chapter is pleased to announce its second meeting of 2015 on May 28th, scheduled from 5:30 pm to 8:00 pm at NTS Baltimore formerly Trace Labs, 5 North Park Drive, Hunt Valley, MD 21030. The focus of this chapter meeting will be “Failure Analysis Process for Printed Board Assemblies” presented by John M. Radman, Senior Applications Engineer, NTS Baltimore.

Eventually everything fails. Typically, when a product fails before its expected end-of-life, determining the cause of the failure is useful. Knowing the cause can initiate design, manufacturing, and end-use changes that can prevent similar failures from occurring in the future. Since all failures are unique to the product involved, all root-cause failure analyses must also be unique. Failure analysis should be a fluid process and not adhere too closely to rigid procedures. The failure analysis scientist must rely on judgment, experience, knowledge, test results, and the information provided by the requestor to conduct a proper analysis. Decisions on which tests are performed and on a proper sequence of testing usually change during the course of an analysis, as a result of the data from previous tests. Additionally, time constraints and cost may play a part in determining the actual steps of an analysis. The requestor’s needs and goals should be the main driving factor in determining the path of the analysis. This presentation will cover two possible failure locations: on the board and within connections between the board. It will provide the path of a typical failure analysis and show real-life examples that will serve as a guideline for conducting failure analysis.

John Radman is currently the Senior Applications Engineer at NTS Baltimore. Mr. Radman has a BS in Physics from University of Maryland and has worked for Trace Labs / NTS for the past 25 years. His primary focus is on electronics and materials testing which includes new product development and material properties comparison. Mr. Radman is the author of many articles and technical presentations on topics which include failure analysis, test techniques, and counterfeit component analysis. He is the Chair of the IPC Ion Chromatography / Ionic Conductivity Task Group and Chair of SAE-G19A- Miscellaneous Techniques Subcommittee (Counterfeit Components) and past treasurer of the Rocky Mountain Chapter of SMTA.

The evening is scheduled as follows:

5:30-6:30 pm Registration, Networking and Dinner

6:30-7:30 pm Presentation: “Failure Analysis Process for Printed Board Assemblies” by John M. Radman

7:30-8:00 pm Tour and Q & A Session

Location:

NTS Baltimore (formerly Trace Labs)

5 North Park Drive

Hunt Valley, MD 21030

(410) 584-9099

Please join us for this networking, learning and dinner event. The registration fees are $20 for members and $30 for non-members. Any new member that joins the chapter at this event can attend the next chapter meeting for FREE.

To RSVP, please click on the following link:

http://www.smta.org/chapters/rsvp.cfm?BEE_ID=3607&BULK_EMAIL_NO=1


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information or to join, please visit www.smta.org.

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SMTA Capital Chapter to Host Second Meeting of the Year on May 28th at NTS Baltimore on “Failure Analysis Process for Printed Board Assemblies” by John M. Radman news release has been viewed 485 times

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  • SMTA Capital Chapter to Host Second Meeting of the Year on May 28th at NTS Baltimore on “Failure Analysis Process for Printed Board Assemblies” by John M. Radman
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