Solder Joint Encapsulant

May 13, 2015

The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives. This highly sophisticated Pb-free formula has been designed for mass production by dipping, printing or dispensing; replacing the traditional solder paste plus underfilling processes. Research examining the efficacy of this process evidences gains of 5-10x the strength of solder joints, surface homogeneity, thermal cycling performance and yield.

With the miniaturization of electronics, manufacturers have been presented with having to focus on finding solutions to weakening of various components. YINCAE offers a variety of Solder Joint Encapsulation Adhesive solutions for wafer level, flip chip, POP, LGA, BGA and many more. YINCAE offers SJEA for low, medium, and high temperature solder alloy applications with differential chemistry and electrical/ thermal conductivity for your individualized needs.

The reflow process of SJEA is in full alignment with typical solder paste reflow profiles and raises the bar on industry standards. Replacing high temperature reflow formulas with this level of sophistication, YINCAE's SJEA provides a myriad of advantages including: the removal of bumps and metal oxides pads for surface homogeneity, better wetting, in-line curing and excellent stability at room temperature. With these advancements. YINCAE marks a new phase in industry growth, development and design for global leaders in technology. 

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