SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Engineered Materials Systems, Inc.


Engineered Material Systems Debuts CA-180 Low-Temperature Cure Conductive Adhesive

May 04, 2015

CA-180 Low-Temperature Cure Conductive Adhesive.

CA-180 Low-Temperature Cure Conductive Adhesive.

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, introduces its newest conductive adhesive – CA-180. The low-temperature cure conductive adhesive has been designed for die attach and general circuit assembly applications.

CA-180 cures in 30 minutes at 80°C, three minutes at 100°C or 10 seconds at 150°C with an electrical conductivity of 4 x 10-5 ohm-cm. Applications where the components are temperature-sensitive and require high conductivity interconnects are ideal for this material. CA-180 has a 48-hour work life and a 12,000 cP viscosity at 5 rpm for easy needle dispensing or application by pin transfer.

CA-180 was developed to pass the rigorous reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications. CA-180 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the CA-180 low temperature curing adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

You must be a registered user to talk back to us.

More News from Engineered Materials Systems, Inc.

Nov 14, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Oct 04, 2016 -

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Sep 13, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 08, 2016 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Aug 08, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Dec 05, 2015 -

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

Aug 26, 2015 -

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

Aug 23, 2015 -

Engineered Material Systems Introduces DF-3050 Dry Film Negative Photoresist

Jul 21, 2015 -

Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing Solar Modules

Jun 17, 2015 -

Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist

(40) more news from Engineered Materials Systems, Inc.

Engineered Material Systems Debuts CA-180 Low-Temperature Cure Conductive Adhesive news release has been viewed 272 times

Boundary Scan

BGA Rework Services