The IMAPS New England Symposium & Expo 2015 is less than two weeks away. This year IMAPS New England Symposium will take place on May 5th. It will be held at the Holiday Inn Conference Center in Boxborough, MA.
Dr. Yin YINCAE President, will be giving an encore presentation of his White Paper: The Future of Solder Joint Encapsulant Adhesives. This paper will focus on the electronic industry and the increasing interest in using solder joint encapsulants. The paper discusses how YINCAE has developed the solder joint encapsulant product family and the benefits that it can bring to a manufacturer’s assembly process.
Dr. Yin’s encapsulant products have solved a number of technical issues related to microchip solder joint strength, uniformity, and thermal cycling. Tests comparing flux in nitrogen versus encapsulants in normal air flow have demonstrated that encapsulants can increase pull strength by at least 5 times, while reducing thermal cycling failures by 10 times. This data translates to significant production savings for microelectronics manufacturers.
We are looking forward to seeing you at this symposium. We will be available to talk about our products and answer any questions that you may have. We have exclusive products unique in the industry. There is a lot that can be taken away from not only Dr. Yin’s presentation, but from IMAPS New England Symposium & Expo 2015 as a whole. We hope to see you there!
YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.