SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • The IMAPS New England Symposium & Expo 2015 is less than two weeks away.

The IMAPS New England Symposium & Expo 2015 is less than two weeks away.

Apr 24, 2015

The IMAPS New England Symposium & Expo 2015 is less than two weeks away. This year IMAPS New England Symposium will take place on May 5th. It will be held at the Holiday Inn Conference Center in Boxborough, MA.

Dr. Yin YINCAE President, will be giving an encore presentation of his White Paper: The Future of Solder Joint Encapsulant Adhesives. This paper will focus on the electronic industry and the increasing interest in using solder joint encapsulants. The paper discusses how YINCAE has developed the solder joint encapsulant product family and the benefits that it can bring to a manufacturer’s assembly process.

Dr. Yin’s encapsulant products have solved a number of technical issues related to microchip solder joint strength, uniformity, and thermal cycling. Tests comparing flux in nitrogen versus encapsulants in normal air flow have demonstrated that encapsulants can increase pull strength by at least 5 times, while reducing thermal cycling failures by 10 times. This data translates to significant production savings for microelectronics manufacturers.

We are looking forward to seeing you at this symposium. We will be available to talk about our products and answer any questions that you may have. We have exclusive products unique in the industry. There is a lot that can be taken away from not only Dr. Yin’s presentation, but from IMAPS New England Symposium & Expo 2015 as a whole. We hope to see you there!


YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.

Jun 20, 2017 -

SEMICON West is 1 Month Away, Visit Yincae at Booth 5248

Jun 19, 2017 -

DA 90 Low Temperature Die Attach Adhesive Series Materials

Jun 13, 2017 -

SMT 158UL Highly Filled Room Temperature Underfill

Jun 06, 2017 -

SMT 88UL Super-Fast Flow Room Temperature Underfill

Jun 05, 2017 -

New Innovative Solder Joint Encapsulant Paste: SMT 256EP

May 04, 2017 -

PRESS RELEASE: SEMICON West July 11-13, 2017

Jan 24, 2017 -

PRESS RELEASE: New Product Announcement

Jan 18, 2017 -

Press Conference at IPC APEX EXPO 2017

Jan 13, 2017 -

IPC APEX EXPO is 1 month away

Aug 24, 2016 -

SMTA INTERNATIONAL JUST A MONTH AWAY! VISIT YINCAE BOOTH #129 September 27th & 28th

18 more news from YINCAE Advanced Materials, LLC. »

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 20, 2017 -

Micro-Focused IR Thermal Testing with PDR's Focused IR

Jun 20, 2017 -

SCS to Present ‘Using Conformal Coatings to Mitigate System Failures’ during upcoming Webinar

See electronics manufacturing industry news »

The IMAPS New England Symposium & Expo 2015 is less than two weeks away. news release has been viewed 388 times

  • SMTnet
  • »
  • Industry News
  • »
  • The IMAPS New England Symposium & Expo 2015 is less than two weeks away.
Used PCB Equipment - AdoptSMT

PCB Buffers