SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Surface Mount Technology Association (SMTA)


International Wafer-Level Packaging Conference (IWLPC) Call for Papers

Apr 07, 2015

SMTA and Chip Scale Review magazine are pleased to announce plans for the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.

The conference includes three tracks with two days of technical paper presentations covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging. If you would like to present at this conference, please submit a 200-300 word abstract by April 17, 2015. Please include a title, author name, and contact information with your abstract. Technical papers are required and will be due August 21, 2015.

For more information, please contact Patti Coles at 952-920-7682 or patti@smta.org.

IWLPC will return to the DoubleTree Hotel in San Jose, California from October 13-15, 2015. Visit http://www.iwlpc.com/ for more information.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

You must be a registered user to talk back to us.

More News from Surface Mount Technology Association (SMTA)

Feb 05, 2017 -

SMTA Announces 2017 Educational Programming

Jan 24, 2017 -

The SMTA Capital Chapter to Host First Meeting of the Year on February 23rd at The Test Connection

Jan 20, 2017 -

Symposium on Counterfeit Parts and Materials Call for Abstracts

Jan 17, 2017 -

International Conference on Soldering and Reliability Call for Abstracts

Dec 20, 2016 -

SMTA International 2016 Best Papers Announced

Nov 22, 2016 -

Hutchins Grant Award Winner Announced

Nov 22, 2016 -

SMTA Capital Chapter Final Meeting of 2016 a Great Success at Zentech

Oct 20, 2016 -

Preventing the Big 7 Mistakes of SMT Electronics Assembly with Expert Phil Zarrow

Oct 20, 2016 -

Preventing the Big 7 Mistakes of SMT Electronics Assembly with Expert Phil Zarrow

Oct 20, 2016 -

LED A.R.T. Symposium Program Announced

(539) more news from Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Call for Papers news release has been viewed 580 times

PCB Assembly Equipment Auctions

SMT Spare Parts and Feeders