SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Vi TECHNOLOGY to Display Award-Winning SPI and AOI at SMT Hybrid Packaging

Vi TECHNOLOGY to Display Award-Winning SPI and AOI at SMT Hybrid Packaging

Apr 07, 2015

PI's 360° Moiré technology.

PI's 360° Moiré technology.

Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in Booth 7A-331 at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

Displayed at the booth will be PI, Vi TECHNOLOGY's award-winning SPI system that has been recognized by the industry as the most innovative SPI product since the introduction of Moiré systems. PI's 360° Moiré technology, offers a unique review image and outstanding performance through unambiguous Z referencing and compensation.

PI is the only inspection system to program automatically, therefore inspection quality is not reliant on the training of the programmer.  Being the new SPI generation, Pi is fully connectable and provides solutions to improve processes. Combined with Sigma Link and AOI solutions, Pi enables the user to improve processes through a complete analysis of the solder joints versus solder paste deposit. Pi also is compatible with all major printers.

Also on display will be the 5K Series which offers flexibility for wider board applications and benefits from all the latest Vi TECHNOLOGY innovations, including Selective 3D AOI technology for accurate tilt and coplanarity measurement of ICs, connectors and passive components if 3D inspection of specific parameters is required. The series also provides enhanced color viewing on the DefectViewer station to facilitate operator repair jobs.

The innovative and modular concept of the 5K Series allows companies requiring entry-level or mid-range AOI systems to upgrade their equipment on-site to meet future requirements. The series has been designed with best-in-class hardware and software technologies to provide accuracy and repeatability and a short cycle time.

Finally, Sigma Review is a new web-based multi-step multi-line review software that will be highlighted at the show.  By displaying & correlating both SPI and AOI data and images, including reference images, Sigma Review opens the way to defect root cause analysis.  Predefined IPC defect categories offer a simple and robust classification environment.  Based on the classified defects, Sigma Review can suggest corrective actions for the operator.  Sigma Analysis is a new web-based real-time yield analysis software that offers powerful data mining solutions and drill down analysis.For more information, stop by booth 7A-331 at the show, or visit www.vitechnology.com.


Vi TECHNOLOGY is a global designer, manufacturer and supplier of a wide range of innovative inspection equipment and software solutions for PCB assembly. Vi TECHNOLOGY serves very demanding market segments including telecoms, consumer, computer, automotive, infrastructure, industrial and medical.

Feb 01, 2018 -

3D SPI from Vi TECHNOLOGY at ENOVA Lyon

Jan 28, 2018 -

Vi TECHNOLOGY to Introduce New Sigma Line Module at APEX

Oct 17, 2017 -

Vi TECHNOLOGY prepares for a busy productronica

Sep 05, 2017 -

Vi TECHNOLOGY Couples Its 5K3D AOI with the PI Series 3D SPI at ENOVA Paris

Aug 23, 2017 -

Vi TECHNOLOGY Combines 3D Inspection with SIGMA Link for Smart Factories

Jul 18, 2017 -

Vi TECHNOLOGY Makes a Big Presence at NEPCON South China with Inspection Solutions in Three Booths

Jul 09, 2017 -

Vi TECHNOLOGY Moves Into New Territories

Jun 07, 2017 -

Inspection Expert Jean-Marc Peallat to Present at the InnovationsForum – Mexico

May 17, 2017 -

Green Circuits Forges Ahead with Continuous Improvement Adopting Vi TECHNOLOGY ‘s Optical Inspection solutions

Apr 23, 2017 -

Vi TECHNOLOGY to Exhibit Full Inspection Solution at SMT/Hybrid/Packaging

56 more news from Vi TECHNOLOGY »

Feb 15, 2018 -

New LTE End-to-End Solution for Private Networks Meets Security, Latency Requirements for IoT and Industrial 4.0 ADLINK and MECSware to demonstrate Private LTE at Mobile World Congress

Feb 15, 2018 -

Altek Electronics, Inc. Purchases Ersa’s Smartflow Selective Soldering System

Feb 15, 2018 -

CalcuQuote and Sager Partner Up on Real Time Inventory Integration

Feb 14, 2018 -

SJ InnoTech introduces the low cost HP-520E Printer

Feb 14, 2018 -

Umut Tosun to Instruct Professional Development Course at IPC APEX 2018

Feb 14, 2018 -

John Hengst Joins Inovaxe as Regional Sales and Channel Partner Manager

Feb 14, 2018 -

optical control GmbH to Display SMD Counting Machine at APEX

Feb 14, 2018 -

Show Floor Sells Out for IPC APEX EXPO 2018

Feb 14, 2018 -

PDR Offers IPC 7711/7721 Rev. C Courses

Feb 14, 2018 -

Press Release: DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

See electronics manufacturing industry news »

Vi TECHNOLOGY to Display Award-Winning SPI and AOI at SMT Hybrid Packaging news release has been viewed 805 times

  • SMTnet
  • »
  • Industry News
  • »
  • Vi TECHNOLOGY to Display Award-Winning SPI and AOI at SMT Hybrid Packaging

SMT Equipment Online Auctions