Apr 07, 2015 
MIRTEC, the Global Leader in Inspection Technology, announces that it will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Mirtec will exhibit the new MV-6, an extremely compact 2D inline AOI system with a high inspection performance for a very attractive price. It’s ideal for companies with a smaller budget which would like to invest in an inline AOI system.
The MV-6 is configured with MIRTEC’s exclusive 10 Mega Pixel Top-Down camera with a precision 13.4 µm Telecentric Compound lens and four 10 Mega Pixel Side-View cameras for an enhanced detection of lifted leads and lifted components.
The system is also configured with the advanced 6 Phase colour lighting (RGB, yellow plus 2x white) for a more detailed detection of lifted leads and check of solder paste deposits. Optionally, the MV-6 can also be equipped with MIRTEC’s exclusive Intelli-Scan Laser System, providing superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices.
With the unique combination of 2D inspection and 3D measurement in only one head MIRTEC’s flagship, the MV-9 AOI system, achieves the highest productivity and ultimate inspection performance, falls calls will be avoided. For the 3D measurement the MV-9 system is working with the "Shadow Free" Moiré Phase Shift image processing. Additionally it is equipped with the 6 Phase colour lighting system for an optimized recognition of lifted leads.
The MV-9 utilizes a high resolution digital 15 MP camera technology with telecentric lens. The four 10 MP side cameras (Side-Viewer®) offer a spacial test and provide valuable information for a secure and reliable detection of side defects. Also, the inspection of complex components is greatly enhanced. The MV-9 is now also available with a 25 MP camera and 7.7 µm lens for components down to 03015.
Also on display will be the MS-15 In-Line SPI System. It also uses the shadow free Moiré Phase Shift Imaging technology to inspect solder paste depositions on PCBs post screen print for insufficient or excessive solder, shape deformity, shift of deposition and bridging. The MS-15 uses the same high precision platform as MIRTEC’s MV-9 Series.
Both systems, the MV-9 and the MS-15, can additionally be equipped with the new CoaXPress which leads to an increase of inspection speed of around 25% compared to the standard camera technology. CoaXPress combines the simplicity of coaxial cable with state of the art high speed serial data technology. The combination of these two features provides a revolutionary leap forward in high speed image and data transmission.
The MV-3 Desktop AOI System has been designed to automatically inspect for manufacturing defects both pre and post reflow. The MV-3 systems offer superior fault coverage and will detect defects such as component presence/absence, polarity, miss alignment, insufficient solder, solder bridging, etc. The system software is very powerful yet extremely simple to use. With its perfect cost-performance ratio this system addresses especially companies with small and medium productions.
At the booth, visitors can learn more about MIRTEC’s total quality management system software, INTELLISYS. This software suite promotes continuous process improvement by allowing the manufacturers to track and eliminate defects on inspected assemblies.
Part of this software is INTELLI TRACK which allows the user to analyze exactly the source of the failure and to eliminate this, to change information upstream and downstream to the production flow and due trend analysis enter into the process before a failure is produced at all.
For more information, stop by booth #7A-504 at the show, or visit www.mirtec.com or www.pbtecsolutions.com.
