SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Teradyne


Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors

Apr 03, 2015

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NYSE: TER) announces the release of three enhancements to the UltraFLEX platform to meet the emerging needs of the latest generation application and baseband processors for mobile devices. New versions of UltraFLEX digital and DC options provide greater pattern memory depth, data rates and accuracy to improve the test quality and yield of ICs for mobile applications.

The UltraPin1600+ implements both memory and speed improvements to UltraFLEX's high-density and high-performance digital test option. Pattern memory depth has been doubled to up to 1G vector per pin, with a total scan depth up to 6 Gb. In addition, digital data rates up to 2.2 Gbps are now supported, an increase of 40%. This allows low-cost, at-speed characterization and production test of the fastest LP-DDR3 memory interfaces on mobile processor devices.

Teradyne also released higher-accuracy versions of its highest density device power supply options, the UVS256+ and HEXVS+. Voltage accuracy has been improved by 50% or greater, resulting in sub-millivolt performance for critical core voltage trimming applications that optimize battery life in mobile products. The UVS256+ and HEXVS+ also offer high-output stability for production ATE, which becomes critical as the digital content of system-on-a-chip devices increases.

The enhanced versions of the UltraPin1600, UVS256 and HEXVS are available immediately and program and application hardware are compatible with previous versions. The options are currently in production use at multiple customer sites.

"Producers of mobile processor devices face the challenge of maintaining the highest device yields with near-zero defect rates and performance demanded by smartphone and tablet device manufacturers," said Ken Lanier, Marketing Manager for Computing and Broadband, Teradyne. "Tester inaccuracies of just a few millivolts or tens of picoseconds force a no-win choice between compromised device performance and higher costs due to reduced yield. UltraFLEX digital and DC options offer unrivaled performance that allows our customers to produce higher quality devices at lower cost. The increased pattern memory depth and data rates of the UltraPin1600 and improved power supply accuracies will also ensure that capital investments in UltraFLEX will address devices requirements for many years to come."

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Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors news release has been viewed 485 times

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