SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors

Apr 03, 2015

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NYSE: TER) announces the release of three enhancements to the UltraFLEX platform to meet the emerging needs of the latest generation application and baseband processors for mobile devices. New versions of UltraFLEX digital and DC options provide greater pattern memory depth, data rates and accuracy to improve the test quality and yield of ICs for mobile applications.

The UltraPin1600+ implements both memory and speed improvements to UltraFLEX's high-density and high-performance digital test option. Pattern memory depth has been doubled to up to 1G vector per pin, with a total scan depth up to 6 Gb. In addition, digital data rates up to 2.2 Gbps are now supported, an increase of 40%. This allows low-cost, at-speed characterization and production test of the fastest LP-DDR3 memory interfaces on mobile processor devices.

Teradyne also released higher-accuracy versions of its highest density device power supply options, the UVS256+ and HEXVS+. Voltage accuracy has been improved by 50% or greater, resulting in sub-millivolt performance for critical core voltage trimming applications that optimize battery life in mobile products. The UVS256+ and HEXVS+ also offer high-output stability for production ATE, which becomes critical as the digital content of system-on-a-chip devices increases.

The enhanced versions of the UltraPin1600, UVS256 and HEXVS are available immediately and program and application hardware are compatible with previous versions. The options are currently in production use at multiple customer sites.

"Producers of mobile processor devices face the challenge of maintaining the highest device yields with near-zero defect rates and performance demanded by smartphone and tablet device manufacturers," said Ken Lanier, Marketing Manager for Computing and Broadband, Teradyne. "Tester inaccuracies of just a few millivolts or tens of picoseconds force a no-win choice between compromised device performance and higher costs due to reduced yield. UltraFLEX digital and DC options offer unrivaled performance that allows our customers to produce higher quality devices at lower cost. The increased pattern memory depth and data rates of the UltraPin1600 and improved power supply accuracies will also ensure that capital investments in UltraFLEX will address devices requirements for many years to come."

Apr 03, 2015 -

Teradyne Introduces IG-XL Real Time Audit Tool To Drive Higher Test Program Quality

Apr 03, 2015 -

Semiconductor Defect Density and Time-to-Market Improved with New Teradyne Toolset

Apr 03, 2015 -

Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

Apr 03, 2015 -

UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers

Apr 03, 2015 -

Mercedes Johnson Elected to Teradyne's Board of Directors

Apr 03, 2015 -

Teradyne Spectrum HS High-Performance Test System Unveiled at AUTOTEST Conference

Apr 03, 2015 -

Teradyne Acquires Avionics Interface Technologies

Apr 03, 2015 -

Teradyne Reports Fourth Quarter and Fiscal Year 2014 Results

Apr 03, 2015 -

Registration Opens for 2015 Teradyne Users Group Conference

Apr 03, 2015 -

Teradyne Showcases Solutions for Integrated Lab and Production Test at SEMICON China 2015

18 more news from Teradyne »

Jun 28, 2017 -

Vapor Phase Manufacturer IBL Technologies Holds 30 Year Anniversary Event

Jun 28, 2017 -

COT Completes $2 Million Expansion of Its Gainesville, Georgia Manufacturing Headquarters

Jun 28, 2017 -

Ersa Versaflow Level II Application Training Course

Jun 28, 2017 -

SMTA Releases Wave Soldering Online Course

Jun 27, 2017 -

Flying Probe, Functional Test & Inline Test – Visit Acculogic at SMTA Ohio Expo

Jun 27, 2017 -

VJ Technologies and Datest Partner in West Coast Inspection Services, Showroom and Demonstration Center.

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

See electronics manufacturing industry news »

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors news release has been viewed 644 times

  • SMTnet
  • »
  • Industry News
  • »
  • Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors
SMT Prototype Stencils - BEST, Inc.

PCB Rework / Repair Services