SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution

Apr 03, 2015

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, Inc. (NYSE: TER), the market leader in wireless device test, introduced its latest wireless test solution for the UltraFLEX test platform. This release expands on Teradyne's market-leading position by introducing a new RF instrument, the UltraWave24, a new DSP Processor, the UltraDSP1, and the latest version of the Enhanced Signal Analyzer (ESA) Toolkit. These products continue to enhance the UltraFLEX's industry-leading performance while reducing program development time, shortening time-to-market and driving down the cost-of-test. Teradyne has received orders from multiple customers for this next generation wireless test solution and it is currently in production at multiple manufacturing sites.

The UltraWave24 is Teradyne's sixth generation RF instrument. Each new generation has expanded performance capability while continuing to drive down the cost-of-test. The resource density of the UltraWave24 was increased to enable higher parallelism for next-generation devices. Parallelism was also increased by a factor of two for most critical functions including RF receivers, modulated sources and multi-tone sources. In addition, the modulation bandwidth of the UltraWave24 was expanded to enable full specification testing of emerging wireless standards, including 802.11ac and LTE-A. The UltraWave24 is fully self-contained when sourcing and capturing modulated waveforms since no other tester resources are used. The phase noise and amplitude accuracy performance of the instrument is uniquely capable of achieving the test quality requirements for future LTE-A devices.

The UltraDSP1 expands the native background DSP processing capability of the UltraFLEX by providing up to 32 dedicated processing cores. LTE-A and testing of Error Vector magnitude, combined with the increase in available frequency bands and higher test parallelism, is increasing the volume of test by a factor of 10 or more per generation. UltraDSP1 provides the computational horsepower to handle this rapid growth without increasing test times. The UltraFLEX offers a dedicated, scalable processing solution for background data analysis of RF tests while moving data automatically, with no user intervention, resulting in less test code, faster test times and shorter time-to-market.

The ESA Toolkit leverages Agilent's 89600VSA Version 17.22 software to get the latest support for the most challenging communications standards. It integrates Agilent's industry-standard algorithms and debug tools with Teradyne's Signal Definition Editor into the IG-XL test environment to make test development and debug simple and fast. The ESA Toolkit allows users to program complicated modulation and demodulation tests with fewer lines of code, making the ESA Toolkit the premier modulation test environment. Whether it is the most complicated 802.11ac MU-MIMO modulation scheme, multi-channel intra-band Carrier Aggregation testing for LTE-Advanced or any other Agilent VSA standard, the ESA Toolkit is equipped to give customers an easy way to implement, debug and correlate the most difficult tests.

"The combination of the UltraWave24 instrument, UltraDSP1 computer, and ESA Toolkit builds on the strong position that the UltraFLEX has achieved in the test of leading edge LTE Advanced transceivers and 802.11ac radios," said Stephen Pruitt, RF Segment Manager at Teradyne. "The continued expansion of the LTE-A and 802.11ac standards require production test equipment with bench level measurement performance and the infrastructure to handle the enormous amounts of measurement data. The UltraFLEX Wireless Test Solution provides the solution to that challenge."

Apr 03, 2015 -

Teradyne Introduces IG-XL Real Time Audit Tool To Drive Higher Test Program Quality

Apr 03, 2015 -

Teradyne Introduces Enhanced Instrument Options for UltraFLEX to Meet the Challenges of Next Generation Mobile Processors

Apr 03, 2015 -

Semiconductor Defect Density and Time-to-Market Improved with New Teradyne Toolset

Apr 03, 2015 -

UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers

Apr 03, 2015 -

Mercedes Johnson Elected to Teradyne's Board of Directors

Apr 03, 2015 -

Teradyne Spectrum HS High-Performance Test System Unveiled at AUTOTEST Conference

Apr 03, 2015 -

Teradyne Acquires Avionics Interface Technologies

Apr 03, 2015 -

Teradyne Reports Fourth Quarter and Fiscal Year 2014 Results

Apr 03, 2015 -

Registration Opens for 2015 Teradyne Users Group Conference

Apr 03, 2015 -

Teradyne Showcases Solutions for Integrated Lab and Production Test at SEMICON China 2015

18 more news from Teradyne »

Jun 27, 2017 -

Flying Probe, Functional Test & Inline Test – Visit Acculogic at SMTA Ohio Expo

Jun 27, 2017 -

VJ Technologies and Datest Partner in West Coast Inspection Services, Showroom and Demonstration Center.

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Jun 25, 2017 -

Ersa Brings the ‘Little Big One’ to SMTA Ohio – Award-Winning Selective Solder

Jun 25, 2017 -

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Jun 25, 2017 -

Inovaxe Partners with Repstronics in Mexico

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

See electronics manufacturing industry news »

Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution news release has been viewed 848 times

  • SMTnet
  • »
  • Industry News
  • »
  • Teradyne Introduces Next Generation UltraFLEX Wireless Test Solution
Used SMT machines

PCB machines