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Science and Care Converge for Advanced Packaging – See KYZEN at NEPCON Korea

Apr 02, 2015

KYZEN’s innovative new product technology team will exhibit in the InterCEM booth C111 at Electronics Manufacturing Korea, scheduled to take place April 1-3, 2015 in Coex, Seoul. Company representatives will showcase a full line of products for electronic assembly and advanced packaging cleaning.

KYZEN has been pioneering award-winning environmentally responsible precision cleaning technologies for electronics, advanced packaging and metal finishing applications since 1990. This year, KYZEN celebrates 25 years of consistently delivering leading science connected to care in order to persistently create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. Among these solutions are MICRONOX® 2710 and MICRONOX® 2707.

MICRONOX® 2710 is a universal cleaning agent for advanced packaging. Formulated for Optimum Cu pillar compatibility, MX2710 is environmentally friendly and provides brilliant solder joints.

MICRONOX® 2707 is a multi-metal safe cleaning chemistry for advanced packaging. Used at low concentrations, MX2707 is safe on exposed metal and effectively cleans under highly dense die.

MICRONOX® 2710 and MICRONOX® 2707 are available in five, 25 and 200 liter (one, five, and 55 gallon) containers.

KYZEN® and MICRONOX® are registered trademarks in the United States and other countries.


KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.KYZEN.com.

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Science and Care Converge for Advanced Packaging – See KYZEN at NEPCON Korea news release has been viewed 644 times

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