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SMTA Announces Best Paper from 2015 Pan Pacific Symposium

Mar 23, 2015

The 20th Annual Pan Pacific Microelectronics Symposium held February 2-5, 2015, at the Sheraton Kauai Resort highlighted more than 50 papers from 14 countries. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.

As selected by the Technical Committee, the Best Paper Award went to Binghamton University, presented by Peter Borgesen, Ph.D., for their paper titled, “Intermetallics Issues and Challenges in 2.5/3D Assembly Microjoints.”

Technical papers from all sessions are featured in the 2015 Pan Pacific Symposium Proceedings available in the SMTA Bookstore.

2015 marked the 20th anniversary of the Pan Pacific Microelectronics Symposium, one of the longest running events sponsored by the SMTA,” noted steering committee chair Charles E. Bauer, Ph.D., TechLead Corporation.

The 2016 symposium will be held January 25-28 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. Abstracts can be submitted online at www.smta.org/panpac/call_for_papers.cfm. For more information on the Pan Pacific Microelectronics Symposium, contact Tanya Martin at 952-920-7682 or tanya@smta.org.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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