SMT, PCB Electronics Industry News

SMTA Announces Best Paper from 2015 Pan Pacific Symposium

Mar 23, 2015

The 20th Annual Pan Pacific Microelectronics Symposium held February 2-5, 2015, at the Sheraton Kauai Resort highlighted more than 50 papers from 14 countries. Speakers at the Pan Pacific Symposium promoted international technical exchange and joined in a diverse forum for extensive networking among microelectronics professionals from around the world.

As selected by the Technical Committee, the Best Paper Award went to Binghamton University, presented by Peter Borgesen, Ph.D., for their paper titled, “Intermetallics Issues and Challenges in 2.5/3D Assembly Microjoints.”

Technical papers from all sessions are featured in the 2015 Pan Pacific Symposium Proceedings available in the SMTA Bookstore.

2015 marked the 20th anniversary of the Pan Pacific Microelectronics Symposium, one of the longest running events sponsored by the SMTA,” noted steering committee chair Charles E. Bauer, Ph.D., TechLead Corporation.

The 2016 symposium will be held January 25-28 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. Abstracts can be submitted online at www.smta.org/panpac/call_for_papers.cfm. For more information on the Pan Pacific Microelectronics Symposium, contact Tanya Martin at 952-920-7682 or tanya@smta.org.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Sep 18, 2017 -

LED A.R.T. Symposium Program Announced

Sep 06, 2017 -

Women’s Leadership Program at SMTA International

Sep 03, 2017 -

SMART Group to Become SMTA Europe

Aug 29, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Workshops

Aug 26, 2017 -

Electronics in Harsh Environments Conference Announced

Aug 16, 2017 -

SMTA Capital Expo to Feature Essemtec Fox Pick and Place System

Aug 14, 2017 -

Shannan O’Shaughnessy, GVD Corporation, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24

Aug 08, 2017 -

iNEMI’s Bill Bader to Keynote Technical Innovations Symposium at SMTA International

Aug 06, 2017 -

Gerry Partida, Summit Interconnect, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Aug 01, 2017 -

Mike Bixenman, KYZEN Corporation, Wins Best of Presentation Award at the 2017 International Conference on Soldering and Reliability (ICSR)

565 more news from Surface Mount Technology Association (SMTA) »

Sep 18, 2017 -

Seica Inc. participation at SMTAi Schaumburg, Illinois Booth # 315 New Frontiers of Testing -

Sep 18, 2017 -

ACE electronics invests in high-quality 3D inspection

Sep 18, 2017 -

Rework and Professional Soldering from Ersa SMTA Guadalajara Expo

Sep 18, 2017 -

MIRTEC to Exhibit Its Award-Winning MV-6 OMNI 3D AOI System at SMTA Guadalajara

Sep 18, 2017 -

Viscom record earnings confirm success track

Sep 18, 2017 -

Seika to Participate in SMTA Guadalajara Expo

Sep 18, 2017 -

Aegis Software Brings Smart Factory Technology to SMTA International Show with FactoryLogix MES Software

Sep 18, 2017 -

Excel Electronics, Inc. Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

Sep 18, 2017 -

BTU International to Participate in Industry 4.0 Panel Discussion at SMTAI Optimizing Oven Dynamics – The Next Step in Smart Factory Automation

Sep 18, 2017 -

SMT Soldering Equipment Reflow Tool for Industry 4.0 – Frost & Sullivan Award

See electronics manufacturing industry news »

SMTA Announces Best Paper from 2015 Pan Pacific Symposium news release has been viewed 728 times

PCB machines

HeatShield Gel- thermal PCB shield during reflow