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Viscom to showcase advanced 3D Inspection solutions and new TrueYield concept for line performance optimization

Mar 17, 2015

X7056 FPD in-line 3D AXI/ 3D AOI combo system.

X7056 FPD in-line 3D AXI/ 3D AOI combo system.

At the upcoming 2015 Nepcon Shanghai show Viscom AG, leading manufacturer of highly precise and efficient inspection systems for the electronics industry, will showcase its latest innovations, demonstrating the highlights of its most advanced and comprehensive range of 3D- AOI, SPI and X-ray inspection systems.

New X7056 FPD in-line 3D AXI/ 3D AOI combo system

For the first time in China Viscom will unveil the new and completely redesigned version of its most succesfull and well established in-line automatic X-ray inspection system X7056. Now eqipped with powerfull digital flat panel detectors and X/Y stages the new X7056 FPD allows for even more accurate planar 3D analysis of hidden fine-pitch solder joints such as µBGA, QFNs and stacked packages (PoP) achieving a 300% improvement in x-ray image quality.

On top of that the X7056 FPD is now optionally equipped with Viscom’s new high-speed 3D XM camera module with up to 8 angular views and fast shadow-free 3D inspection which allows for the most efficient simultaneous 3D AOI inspection.

TrueYield – the most comprehensive toolset for optimum line performance

Furthermore, Viscom introduces its new TrueYield approach to maximize yields with the best defect detection and lowest false alarms. With the combination of integrated verification to check programs with verified known defects, known good sample data, process uplink with process data analysis from several testgates and TCM, the automatic machine health check tool provides superior true yield improvement capabilities.

The most advanced range of 3D AOI, SPI and AXI systems

Other systems at display at booth B-1G40 at the Shanghai World Expo Convention Center between the 21st and 23rd of April include the standard the powerful S3088 ultra 3D AOI system with the high-speed Viscom XM-module, the innovative 3-D solder paste inspection system S3088 SPI 3D and the efficient and flexible conformal coating inspection system S3088 CCI.


Viscom AG develops, manufactures and sells high-quality inspection systems. The portfolio encompasses the complete bandwidth of optical and X-ray inspections. In the area of assembly inspection for electronics manufacturing, the company is among the leading suppliers worldwide. Viscom systems can be configured specific to the customer and can be interlinked. The company headquarters and manufacturing location is in Hanover, Germany. With a wide network of branches, applications centers, service support points and representatives, Viscom is represented internationally. Founded in 1984, since 2006 Viscom has been listed on the Frankfurt Stock Exchange (ISIN: DE0007846867). For additional information: www.viscom.com

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