SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from KIC Thermal

Say Goodbye to Manual Profiling – Let KIC Schedule Automatic Profiling at NEPCON China

Mar 16, 2015

X5 Profiler

X5 Profiler

KIC today announced that it will exhibit in Stand B-1D40 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will demonstrate the Footprint, ProBot, X5, K2 and Mobile Profile Viewer APP.

The Footprint allows one-click oven monitoring and eliminates frequent profiling and thermal process windows. It monitors the oven temperature variations along the conveyor and conveyor speed in real-time. The Footprint automatically measures the acceptable drift and alerts the user when conditions are unacceptable.

The ProBot automatic profiling system reduces the need for time consuming periodic profiling. ProBot will immediately identify if the oven is ready for in-spec production, receive warnings/alarms if the process drifts and automatically send product-related yield data to third party management/MES systems.

The X5 Profiler redefines what a data intelligence profiler can and should do.  As opposed to the low-cost data acquisition profilers that focus purely on recording a product profile, a data intelligence profiler takes the additional active role of suggesting new oven setup in order to optimize the thermal process. The X5 ships standard with process optimization software.

The K2 Thermal Profiler builds on KIC’s tradition of a compact and robust hardware that measures profiles accurately, even in harsh environments.  The plug-and-play hardware and graphical user interface makes profiling both quick and easy.  The KIC software enables each thermocouple to use its own unique process window, while the optimization software automatically suggests the best oven setup to process the entire PCB and components in spec.  This convenience, combined with lightning fast speed, allows oven setup in a few seconds.

The profile data measured by the K2 can now be viewed both on a PC as well as on authorized Android and Apple mobile devices. The Mobile Profile Viewer App also is WiFi and Bluetooth compatible.

For more information, meet with company representatives at NEPCON China or visit

Based in San Diego, KIC is the industry leader in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and then worked to create the next generation of thermal systems to help manufacturers improve the thermal process quality while reducing cost.

KIC products include the KIC K2, X5, KICstart2, ProBot, 24/7 Wave and the KIC RPI. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and automatic thermal process systems, and has won numerous industry awards.

You must be a registered user to talk back to us.

More News from KIC Thermal

May 03, 2017 -

KIC’s MB Allen to Discuss Thermal Process Data Collection at SMTA Michigan

May 01, 2017 -

Reduce costs through thermal process optimization with KIC at SMT Nuremberg

Mar 22, 2017 -

Smart Profiling System at NEPCON Shanghai – KIC SPS

Mar 17, 2017 -

KIC Debuts New Smart Profilers

Feb 07, 2017 -

KIC Brings on New R&D Manager

Jan 24, 2017 -

KIC Strengthens Its Sales Channels & Customer Support in the Upper Midwest

Jan 10, 2017 -

KIC introduces the $35,000 Smart Factory Starter Kit at APEX

Jan 03, 2017 -

KIC Celebrates 40 Years of Helping Manufacturers Improve Quality & Reduce Costs Through Thermal Process Optimization

Nov 17, 2016 -

ACI Technologies Conducts Hands-on Profiling and Solder Reflow Course with KIC Equipment

Oct 17, 2016 -

MB Allen to Present Recent Research at the SMTA Space Coast Expo

(168) more news from KIC Thermal

Say Goodbye to Manual Profiling – Let KIC Schedule Automatic Profiling at NEPCON China news release has been viewed 515 times

reflow oven profiler

Capillary Underfill process