SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE’s Peter Koch to Discuss Failure Analysis with X-ray at EPP’s Innovations Forum

Nordson DAGE’s Peter Koch to Discuss Failure Analysis with X-ray at EPP’s Innovations Forum

Mar 03, 2015

Peter Koch

Peter Koch

 Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch will present on the subject of “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT” at the EPP Innovations Forum, scheduled to take place on Thursday, March 12, 2015 at the Kongresshalle in Böblingen, Germany. 

Mr. Koch will discuss failures on BGAs, HiP (Head-in-Pillow) defects, cracks and simple failures such as solder bridges. Most of these failures can be detected with 2D inspection; however, sometimes it is necessary to use other techniques such as X-Plane™ (Tomosynthesis) and CT.  Additionally, Mr. Koch will discuss how the shape of the BGA balls or voiding can give a good indication of the failure.

The presentation will analyze failures on different components such as resistors, capacitors and wire bonds.  Nordson DAGE X-Plane® and CT-images will be shown. Mr. Koch will conclude with an example of how useful X-ray can be to find a manipulation on a device.

Peter Koch studied the Science of Materials at the Technical University in Erlangen-Nürnberg, Germany. He is Nordson DAGE’s European X-Ray Application Engineer and has worked for the company for the last ten years.For more information about Nordson DAGE, visit www.nordsondage.com.


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.

Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.  Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp  or www.facebook.com/nordson.

Oct 24, 2017 -

Nordson DAGE Announce 2017 European X-ray Distributor Award Winners

Oct 17, 2017 -

Nordson Test & Inspection Announces Lineup for productronica

Oct 12, 2017 -

Nordson DAGE to Discuss Its Wafer X-ray Metrology Platform at IWLPC

Sep 12, 2017 -

Nordson Brings its Flagship Inspection Systems to SMTAI

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 15, 2017 -

Nordson Brings Its Flagship Inspection Systems to SMTAI

Jun 13, 2017 -

Nordson Showcases Its Market-Leading Test and Inspection Systems at SEMICON West

Apr 26, 2017 -

Nordson DAGE Picks Up Its Third Award for the Quadra™ 7 X-ray

Feb 15, 2017 -

Nordson DAGE Receives the 2017 NPI Award for Test & Inspection – X-ray

Nov 07, 2016 -

Nordson DAGE Announces Cabiotec as European X-ray Distributor of the Year for X-ray Systems 2016

108 more news from Nordson DAGE »

Feb 19, 2018 -

Horizon Sales Heads to San Diego for APEX!

Feb 19, 2018 -

Cogiscan Is Growing: New Regional Sales Manager for the Americas

Feb 19, 2018 -

CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology Recognized as Best Known Method (BKM) at SEMICON China

Feb 19, 2018 -

Award-Winning Reflow, Selective Solder & Rework from Ersa at SMTA Intermountain Expo

Feb 19, 2018 -

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Feb 19, 2018 -

Nordson YESTECH Installs BX Benchtop AOI System at Fluid Components International

Feb 19, 2018 -

BTU to Demo TrueFlat Technology for Substrate Flatness at SEMICON China

Feb 19, 2018 -

CyberOptics Demonstrates Yield-Improving Wireless Measurement Devices for Semiconductor Tools at SPIE

Feb 19, 2018 -

Presaturated Surface Prep Wipe

Feb 15, 2018 -

New LTE End-to-End Solution for Private Networks Meets Security, Latency Requirements for IoT and Industrial 4.0 ADLINK and MECSware to demonstrate Private LTE at Mobile World Congress

See electronics manufacturing industry news »

Nordson DAGE’s Peter Koch to Discuss Failure Analysis with X-ray at EPP’s Innovations Forum news release has been viewed 773 times

  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE’s Peter Koch to Discuss Failure Analysis with X-ray at EPP’s Innovations Forum
Plasma Prior to Conformal Coating

x-ray inspection system