SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE’s Peter Koch to Discuss Failure Analysis with X-ray at EPP’s Innovations Forum

Nordson DAGE’s Peter Koch to Discuss Failure Analysis with X-ray at EPP’s Innovations Forum

Mar 03, 2015

Peter Koch

Peter Koch

 Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Peter Koch will present on the subject of “Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT” at the EPP Innovations Forum, scheduled to take place on Thursday, March 12, 2015 at the Kongresshalle in Böblingen, Germany. 

Mr. Koch will discuss failures on BGAs, HiP (Head-in-Pillow) defects, cracks and simple failures such as solder bridges. Most of these failures can be detected with 2D inspection; however, sometimes it is necessary to use other techniques such as X-Plane™ (Tomosynthesis) and CT.  Additionally, Mr. Koch will discuss how the shape of the BGA balls or voiding can give a good indication of the failure.

The presentation will analyze failures on different components such as resistors, capacitors and wire bonds.  Nordson DAGE X-Plane® and CT-images will be shown. Mr. Koch will conclude with an example of how useful X-ray can be to find a manipulation on a device.

Peter Koch studied the Science of Materials at the Technical University in Erlangen-Nürnberg, Germany. He is Nordson DAGE’s European X-Ray Application Engineer and has worked for the company for the last ten years.For more information about Nordson DAGE, visit www.nordsondage.com.


Headquartered in Aylesbury, UK, Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.  For more information, visit www.nordsondage.com.

Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service.  Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.  Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.  Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp  or www.facebook.com/nordson.

May 02, 2018 -

Quadruple Industry Recognition for Nordson DAGE Test and Inspection systems at Nepcon China 2018

Mar 21, 2018 -

Nordson DAGE announce the launch of Paragon™ Materials software

Feb 26, 2018 -

Maintenance-Free X-ray Inspection Now Available for PCBA Production Applications

Oct 24, 2017 -

Nordson DAGE Announce 2017 European X-ray Distributor Award Winners

Oct 17, 2017 -

Nordson Test & Inspection Announces Lineup for productronica

Oct 12, 2017 -

Nordson DAGE to Discuss Its Wafer X-ray Metrology Platform at IWLPC

Sep 12, 2017 -

Nordson Brings its Flagship Inspection Systems to SMTAI

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 15, 2017 -

Nordson Brings Its Flagship Inspection Systems to SMTAI

Jun 13, 2017 -

Nordson Showcases Its Market-Leading Test and Inspection Systems at SEMICON West

111 more news from Nordson DAGE »

Jun 21, 2018 -

New Applicator Guns from Techcon at Farnborough International Airshow

Jun 21, 2018 -

IPC’s PCB Technology Trends Study Underway, PCB Fabricator Survey Open Until July 13

Jun 21, 2018 -

YXLON International to Host Three Open House Events at Its Lab One Facility

Jun 21, 2018 -

ROSIN RESINS FOR SOLDERING SOLUTION

Jun 20, 2018 -

ECO-FRIENDLY MEETS HIGH-TECH – Product Launch at Nepcon Thailand

Jun 20, 2018 -

KYZEN Sees Growth in Asia & Expands Marketing Support

Jun 20, 2018 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2019 Deadline for technical conference paper abstracts extended to: June 29, 2018

Jun 20, 2018 -

Inspection Services Labs in San Jose and Ohio Now Fully Equipped with Non-Destructive Testing Technology

Jun 20, 2018 -

VJ Electronix Promotes Frank Cosentino to Western Regional Sales Manager for the Americas

Jun 20, 2018 -

Scienscope Expands Partnership with Restronics

See electronics manufacturing industry news »

Nordson DAGE’s Peter Koch to Discuss Failure Analysis with X-ray at EPP’s Innovations Forum news release has been viewed 7 times

  • SMTnet
  • »
  • Industry News
  • »
  • Nordson DAGE’s Peter Koch to Discuss Failure Analysis with X-ray at EPP’s Innovations Forum
Plasma Prior to Conformal Coating

Reflow Oven Profiler