SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Engineered Materials Systems, Inc.


Engineered Materials Systems Debuts Low-Cost Conductive Adhesive for Stringing or Shingling Solar Modules

Feb 28, 2015

DB-1541-S9 Low-Cost Conductive Adhesive.

DB-1541-S9 Low-Cost Conductive Adhesive.

Engineered Materials Systems, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces its new DB-1541-S9 Low-Cost Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. DB-1541-S9 is designed to electrically interconnect solar cells using ribbons or direct cell to cell contact.

The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to cell and ribbon metallization during damp heat exposure. Additionally, the conductive adhesive is designed to gel rapidly and then complete cure through the encapsulant lamination and cure process. DB-1541-S9 is approximately 50 percent lower cost than standard silver filled conductive adhesives.

The DB-1541-S9 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for photovoltaic applications. For more information about the DB-1541-S9 Low-Cost Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

You must be a registered user to talk back to us.

More News from Engineered Materials Systems, Inc.

Nov 14, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Oct 04, 2016 -

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Sep 13, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 08, 2016 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Aug 08, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Dec 05, 2015 -

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

Aug 26, 2015 -

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

Aug 23, 2015 -

Engineered Material Systems Introduces DF-3050 Dry Film Negative Photoresist

Jul 21, 2015 -

Engineered Materials Systems Introduces Low-Cost Snap Cure Conductive Adhesive for Stringing Solar Modules

Jun 17, 2015 -

Engineered Material Systems Introduces DF-3005 Dry Film Negative Photoresist

(40) more news from Engineered Materials Systems, Inc.

Engineered Materials Systems Debuts Low-Cost Conductive Adhesive for Stringing or Shingling Solar Modules news release has been viewed 341 times

Boundary Scan