SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • PARMI Wins Award for New SPI Defect Repair Feature for SIGMA X New “Jet” module increases SPI throughput and ROI

PARMI Wins Award for New SPI Defect Repair Feature for SIGMA X New “Jet” module increases SPI throughput and ROI

Feb 24, 2015

SIGMA X machine.

SIGMA X machine.

PARMI, a leader in 3-D solder paste inspection (SPI) of printed circuit boards, announces that it has been awarded a 2015 NPI Award in the category of Test & Inspection – SPI for its Jet Defect Repair Feature. This represents the third consecutive year that PARMI has received the award, which was presented during a Tuesday, Feb. 24, 2015 ceremony at the San Diego Convention Center during the IPC APEX EXPO.

Jet repairs solder paste deposits within the SIGMA X machine to eliminate expensive rework and scrap, maximize throughput and increase ROI. It follows the recent introduction of PARMI’s exclusive Printer Doctor feature that automatically analyzes solder paste inspection data in real time, correlates it to printing activities and provides user-defined corrective action.

With more than 2,500 installations worldwide, PARMI leads the industry in SPI performance and innovation. The company’s SPI products have won the New Product Introduction Award from the prestigious Circuits Assembly magazine in recognition of product excellence in the field of electronics surface mount assembly.

Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.


PARMI is a manufacturer specializing in Solder Paste Inspection (SPI) equipment used to improve print quality and yield in SMT production lines. Throughout its ten-year history, the company has specialized in developing in-house expertise in laser measurement, software support and solder paste screen printing.  PARMI is a global leader in solder paste inspection. For more information, visit www.parmi.com.

Jan 21, 2015 -

PARMI to Showcase “The Jet” Inside SPI at APEX 2015

Nov 18, 2014 -

PARMI and Aegis Develop xLink Machine Adapter to Connect SPI Data to FactoryLogix Manufacturing Software in Real-Time

Nov 17, 2014 -

PARMI and Aegis Develop xLink Machine Adapter to Connect SPI Data to FactoryLogix Manufacturing Software in Real-Time

Sep 06, 2014 -

ARMI Announces New SPI Defect Repair Feature for SIGMA X New “Jet” module increases SPI throughput and ROI

May 22, 2014 -

PARMI Appoints Southwest Systems Technology

Mar 26, 2014 -

PARMI Accepts an NPI Award at APEX for its New SIGMA X SPI System

Mar 02, 2014 -

Visit Booth #1249 at APEX – PARMI to Showcase SIGMA X SPI System

Feb 25, 2013 -

PARMI’s HS-70 Solder Paste Inspection System Receives Circuits Assembly’s Prestigious NPI Award

Jan 31, 2013 -

PARMI Opens New Facility in Massachusetts

Jan 17, 2013 -

Visit Booth #1527 at the IPC APEX EXPO ― PARMI to Showcase HS-70 Solder Paste Inspection System

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

Sep 19, 2017 -

ADLINK Technology Showcasing Latest Rugged Embedded Railway Solutions at Major European Railway Exhibitions TRAKO, Expo Ferroviaria and Nordic Rail

Sep 18, 2017 -

Seica Inc. participation at SMTAi Schaumburg, Illinois Booth # 315 New Frontiers of Testing -

Sep 18, 2017 -

ACE electronics invests in high-quality 3D inspection

Sep 18, 2017 -

Rework and Professional Soldering from Ersa SMTA Guadalajara Expo

See electronics manufacturing industry news »

PARMI Wins Award for New SPI Defect Repair Feature for SIGMA X New “Jet” module increases SPI throughput and ROI news release has been viewed 741 times

  • SMTnet
  • »
  • Industry News
  • »
  • PARMI Wins Award for New SPI Defect Repair Feature for SIGMA X New “Jet” module increases SPI throughput and ROI
SMT Custom Nozzles