Feb 24, 2015 
PARMI, a leader in 3-D solder paste inspection (SPI) of printed circuit boards, announces that it has been awarded a 2015 NPI Award in the category of Test & Inspection – SPI for its Jet Defect Repair Feature. This represents the third consecutive year that PARMI has received the award, which was presented during a Tuesday, Feb. 24, 2015 ceremony at the San Diego Convention Center during the IPC APEX EXPO.
Jet repairs solder paste deposits within the SIGMA X machine to eliminate expensive rework and scrap, maximize throughput and increase ROI. It follows the recent introduction of PARMI’s exclusive Printer Doctor feature that automatically analyzes solder paste inspection data in real time, correlates it to printing activities and provides user-defined corrective action.
With more than 2,500 installations worldwide, PARMI leads the industry in SPI performance and innovation. The company’s SPI products have won the New Product Introduction Award from the prestigious Circuits Assembly magazine in recognition of product excellence in the field of electronics surface mount assembly.
Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
PARMI is a manufacturer specializing in Solder Paste Inspection (SPI) equipment used to improve print quality and yield in SMT production lines. Throughout its ten-year history, the company has specialized in developing in-house expertise in laser measurement, software support and solder paste screen printing. PARMI is a global leader in solder paste inspection. For more information, visit www.parmi.com.
