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High Temperature & Ultra Small Passive Component Design Technology Webinars

Feb 22, 2015

Things are getting too hot!!!

Things are getting too hot!!!

We would like to invite you to two free technology webinars based on projects run with the support of NPL. These free webinars will be presented by Dennis Price, Quality Director
Merlin Circuit Technology & Bob Willis, NPL Defect Database Coordinator.

The webinars focus on PCB and assembly technology for High Temperature Electronics and Small Passive Components for Modern Electronics. All you need to do is follow the links to register online free.

Design & Assembly for High Temperature Electronic Applications
Tuesday 24th February 14.30 GMT

Topics Covered include:
PCB substrates and design guidelines
PCB laminate options
Lead-Free & HT Solder alloys
Selective soldering process
Solder joint reliability
Process defects causes & cures

To book your teams place https://attendee.gotowebinar.com/register/3680585851294815746


Design & Assembly of Small Passive Components (0201, 01005 & Smaller Still)
Tuesday 10th March 14.30 GMT

Topics Covered include:
PCB substrates and design guidelines
Laminate & PCB finishes for ultra small pads
Assembly & soldering process
Inspection of joints
Rework methods

To book your teams place https://attendee.gotowebinar.com/register/3752427941054360321

We hope you and your engineering teams can join us for these special technology webinars, limited availability so register early. You may also find our own guide to setting up a webinar on your site useful for single or groups of engineers at www.bobwillisonline.com/pdfs/webinarattendance.pdf

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