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Bob Willis Free EBooks on PoP and Intrusive Reflow Design & Assembly

Feb 19, 2015

PIHR & PoP EBooks

PIHR & PoP EBooks

In the last couple of years Bob has produced two free EBooks for engineers, each with over 100 pages of information, tips and illustrations to make introduction easier. Both titiles are based on practical experience using these techniques in manufacture in different sites.

Our titiles include:

Package On Package Assembly Inspection & Quality Control
Downloaded at http://www.packageonpackagebook.com/

Pin In Hole Intrusive Reflow Desing & Assembly
Download at http://pihrtechnology.com/

Package On Package Assembly Inspection & Quality Control

Topics will include:

Package On Package Assembly Overview
Component packaging
Printed Circuit Board Design
PCB Solder Finishes
Solder Paste Printing
Automatic Optical Inspection
PoP Component Placement
Convection & Vapour Phase Reflow & Profiling
Optical & X-ray Inspection
Cleaning PoP Assemblies
PoP Underfill & Staking
Rework & Reballing Package on Packages
Conformal Coating
Reliability Testing Package On Package
POP Process Assembly Defects
PoP Technical Training Material & Services
PoP Technical Paper Bibliography

Introduction to Pin in Paste Intrusive Reflow
Topics will include:

Pin In Hole Reflow PCB Design Guidelines
PIHR Component Guidelines
Solder Paste Application Methods
Automatic and Manual Component Placement
Reflow SolderingTemperature
Profiling for Pin In Paste Reflow
Solder Joint Inspection and Quality Control
Reliability of Through Hole Reflow
PIHR Manufacturing Defects – Causes and Cures
PIHR Bibliography
PIHR Frequently Asked Questions

May 21, 2017 -

Cleaning & Contamination Defects Photo CD-ROM

Apr 13, 2017 -

Plan your engineering process improvement with a monthly online webinar

Mar 22, 2017 -

Surface Mount Assembly & Defect Photo CD

Mar 08, 2017 -

Lead Free & Tin/Lead Wave Soldering Defect Guide to Download

Mar 06, 2017 -

0201, 01005 & Smaller Soldering, Assembly & Defect Photo CD

Mar 06, 2017 -

Archive Webinar Recordings on Soldering, PCB Assembly & Inspection

Mar 06, 2017 -

Hands on Master Class Series from Bob Willis

Feb 20, 2017 -

SMT and Conventional Photo CD ROM

Feb 11, 2017 -

Join Assembly Soldering Inspection Defects LinkedIn Group

Feb 05, 2017 -

Solder Ball Elimination – In Wave, Selective & Reflow Webinar

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Logic PD Appoints Eric Wilkowske as Vice President of Products, Design & Engineering

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