SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from ASKbobwillis.com


Bob Willis Free EBooks on PoP and Intrusive Reflow Design & Assembly

Feb 19, 2015

PIHR & PoP EBooks

PIHR & PoP EBooks

In the last couple of years Bob has produced two free EBooks for engineers, each with over 100 pages of information, tips and illustrations to make introduction easier. Both titiles are based on practical experience using these techniques in manufacture in different sites.

Our titiles include:

Package On Package Assembly Inspection & Quality Control
Downloaded at http://www.packageonpackagebook.com/

Pin In Hole Intrusive Reflow Desing & Assembly
Download at http://pihrtechnology.com/

Package On Package Assembly Inspection & Quality Control

Topics will include:

Package On Package Assembly Overview
Component packaging
Printed Circuit Board Design
PCB Solder Finishes
Solder Paste Printing
Automatic Optical Inspection
PoP Component Placement
Convection & Vapour Phase Reflow & Profiling
Optical & X-ray Inspection
Cleaning PoP Assemblies
PoP Underfill & Staking
Rework & Reballing Package on Packages
Conformal Coating
Reliability Testing Package On Package
POP Process Assembly Defects
PoP Technical Training Material & Services
PoP Technical Paper Bibliography

Introduction to Pin in Paste Intrusive Reflow
Topics will include:

Pin In Hole Reflow PCB Design Guidelines
PIHR Component Guidelines
Solder Paste Application Methods
Automatic and Manual Component Placement
Reflow SolderingTemperature
Profiling for Pin In Paste Reflow
Solder Joint Inspection and Quality Control
Reliability of Through Hole Reflow
PIHR Manufacturing Defects – Causes and Cures
PIHR Bibliography
PIHR Frequently Asked Questions

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More News from ASKbobwillis.com

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Solder Paste & Stencil Printing Defect Examples Available Royalty FREE

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More BGA Defect Examples Available Royalty FREE

Dec 29, 2016 -

QFN LGA Photos for your Training Courses

Dec 29, 2016 -

Conformal Coating Defect Images for Presentations

Dec 12, 2016 -

NPL 2017 Free Webinars are Launched and Chaired by Bob Willis

Nov 10, 2016 -

NPL Future of Interconnection Reliability - The Way Forward

Nov 04, 2016 -

Robotic Iron & Laser Soldering for Lead-Free & High Temperature Alloys webinar

Oct 21, 2016 -

Online Soldering Webinars for All

Sep 06, 2016 -

New NPL Method for Testing Reliability of Electronics in Condensing Environment FREE Webinar

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