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Bob Willis Free EBooks on PoP and Intrusive Reflow Design & Assembly

Feb 19, 2015

PIHR & PoP EBooks

PIHR & PoP EBooks

In the last couple of years Bob has produced two free EBooks for engineers, each with over 100 pages of information, tips and illustrations to make introduction easier. Both titiles are based on practical experience using these techniques in manufacture in different sites.

Our titiles include:

Package On Package Assembly Inspection & Quality Control
Downloaded at http://www.packageonpackagebook.com/

Pin In Hole Intrusive Reflow Desing & Assembly
Download at http://pihrtechnology.com/

Package On Package Assembly Inspection & Quality Control

Topics will include:

Package On Package Assembly Overview
Component packaging
Printed Circuit Board Design
PCB Solder Finishes
Solder Paste Printing
Automatic Optical Inspection
PoP Component Placement
Convection & Vapour Phase Reflow & Profiling
Optical & X-ray Inspection
Cleaning PoP Assemblies
PoP Underfill & Staking
Rework & Reballing Package on Packages
Conformal Coating
Reliability Testing Package On Package
POP Process Assembly Defects
PoP Technical Training Material & Services
PoP Technical Paper Bibliography

Introduction to Pin in Paste Intrusive Reflow
Topics will include:

Pin In Hole Reflow PCB Design Guidelines
PIHR Component Guidelines
Solder Paste Application Methods
Automatic and Manual Component Placement
Reflow SolderingTemperature
Profiling for Pin In Paste Reflow
Solder Joint Inspection and Quality Control
Reliability of Through Hole Reflow
PIHR Manufacturing Defects – Causes and Cures
PIHR Bibliography
PIHR Frequently Asked Questions

Sep 03, 2017 -

Guide to QFN/LGA & BTC Process Defects Guide & FREE webinar from Bob Willis

Jul 28, 2017 -

PowerPoint presentations on Conventional & SMT Assembly to Download at Bobwillis.co.uk

May 21, 2017 -

Cleaning & Contamination Defects Photo CD-ROM

Apr 13, 2017 -

Plan your engineering process improvement with a monthly online webinar

Mar 22, 2017 -

Surface Mount Assembly & Defect Photo CD

Mar 08, 2017 -

Lead Free & Tin/Lead Wave Soldering Defect Guide to Download

Mar 06, 2017 -

0201, 01005 & Smaller Soldering, Assembly & Defect Photo CD

Mar 06, 2017 -

Archive Webinar Recordings on Soldering, PCB Assembly & Inspection

Mar 06, 2017 -

Hands on Master Class Series from Bob Willis

Feb 20, 2017 -

SMT and Conventional Photo CD ROM

69 more news from ASKbobwillis.com »

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

Sep 19, 2017 -

BTU Introduces Profile Guardian Redundant Process Monitor during SMTAI

See electronics manufacturing industry news »

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