At the upcoming AUTOMATICON 2015 exhibition, taking place March 17 - 20 in Warsaw, Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its award-winning Paraquda in booth B28, hall 1. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and/or glue and mount components in one machine.
SMT placement tasks
Essemtec exhibits Paraquda pick and place System at Automaticon 2015One machine platform processes all types of components – from 01005 to large components or connectors. Unmatched changeover times and a highly flexible assembly are ensured by the highest number of feeder slots (240) per square meter in the market, intelligent, servo-driven kitting without production stop, and an intuitive, touch screen-based operation.
Paraquda platforms are available in different models. Modular construction allows for a gradual increase in performance - first by placement head choice and second by multiplication of modules as well as an expansion by means of options according to the requested applications.
Vary placement performance according to requirements
Depending on the required output, customers can easily exchange the placement heads. Paraquda2 is an identical sister model of the successful pick-and-place system Paraquda4, but with a reduction to 2 Z-axis in the placement head. Paraquda2 can be upgraded to a Paraquda4 at any time with a simple exchange of the placement head.
Thanks to the rental option of a 4 Z-axis placement head, placement performance of production lines can be adapted quickly and flexibly, without investing long term in new equipment and tying up valuable capital. Obviously, customers can permanently upgrade to a Paraquda4 with 4 Z-axis.
3-in-1 production center
Paraquda combines three different production steps within one platform (jet printing of solder paste and/or glue and SMD assembly). The Paraquda meets all the requirements of a modern, highly flexible production system – quick changeover, intuitive operation and the combined usage of jet and/or needle valves. With this unique combination, the multifunctional center allows an unprecedented flexibility in the market.
Prototypes and small series are easily assembled without stencils, reducing turnaround time considerably. Expensive stepped stencils can be eliminated with the dispensing of additional solder paste. Jetting of solder paste allows quicker, more precise solder paste dots than any other system in the market. Everything – from jetting to picking-and-placing components – is done automatically by the machine.
For more information about Essemtec's SMT production center, visit Essemtec Poland in booth B28, hall 1 at the Automaticon or on the web at www.essemtec-polska.com.