SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT

The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT

Feb 04, 2015

Donald Tyler, Managing Director, Corfin Industries.

Donald Tyler, Managing Director, Corfin Industries.

The SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.

Manufacturers of high-reliability electronic systems are having increasing difficulty in obtaining components with termination finishes that meet their needs.  Defense, space, and RoHS-excluded users demand a minimum of 3% lead (Pb) in the termination finish to prevent the possibility of tin whisker growth while RoHS-compliant users require a lead-free alloy free of tin whisker risks.   Robotic Hot Solder Dip (RHSD) provides the solution by using tightly controlled robotic process steps to remove the existing finish and replace it with a compliant finish.

The US Navy funded a ManTech project (TMTI) to qualify specific RHSD process parameters as a safe, reliable means to fully replace pure tin termination finishes with tin-lead (SnPb) on a variety of electronic components.  The components processed under this Navy project included a wide variety of construction styles, including leaded and leadless, plastic, ceramic, metal, glass-sealed, and other variables.  A similar process replaces BGA spheres.  Mr. Tyler will describe and demonstrate the RHSD process parameters and necessary equipment controls to consistently ensure that 100% of the original finish is completely removed and that the component is not damaged in any way.  For those manufacturers needing RoHS compliance, a similar process removes the non-compliant original finish and replaces it with SAC 305 (Tin-Silver-Copper) or other lead free alloys.

Donald Tyler is Managing Director at Corfin Industries (Salem, NH).  Mr. Tyler is actively involved in industry organizations in the US and abroad focused on eliminating risks from Pb-free electronics.  He currently chairs the committee for GEIA-STD-0006 “Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts” and is a primary contributor to the IEC/TS 62647-4 “Process management for avionics – Aerospace and defense electronics systems containing lead-free solder – Part 4: Ball grid array (BGA) re-balling” technical standard with expected release later this year.

The evening is scheduled as follows:

  • 5:30-6:30 pm Registration, Networking and Dinner
  • 6:30-7:30 pm Presentation: “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler
  • 7:30-8:00 pm Q & A

Location:

EIT (Main Building Lunchroom)
108 Carpenter Drive
Sterling, VA 20164
(703) 478-0700

Please join us for this networking, learning and dinner event. The registration fees are $20 for members and $30 for non-members.  Any new member that joins the chapter at this event can attend the next chapter meeting for FREE.

To RSVP, please click on the following link:
http://www.smta.org/chapters/rsvp.cfm?BEE_ID=3536&BULK_EMAIL_NO=1


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.  For more information or to join, please visit www.smta.org.

Jun 20, 2017 -

SMTA Launches New Partnership with Thayer School of Engineering at Dartmouth College

Jun 08, 2017 -

SMTA International Conference Program Finalized and Registration Now Open

May 30, 2017 -

SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium

May 23, 2017 -

SMTA, iNEMI, MEPTEC Seek Presenters for 2018 Medical Electronics Symposium

May 15, 2017 -

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Apr 26, 2017 -

SMTA/CALCE Announce Program for Symposium on Counterfeit Parts and Materials

Apr 11, 2017 -

IBM and Siemens Experts to Keynote Contamination, Cleaning and Coating Conference

Apr 07, 2017 -

The SMTA Capital Chapter to Host a Meeting April 25th at ZESTRON Americas

Mar 15, 2017 -

Contamination, Cleaning and Coating Conference Program Finalized

Feb 05, 2017 -

SMTA Announces 2017 Educational Programming

547 more news from Surface Mount Technology Association (SMTA) »

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 20, 2017 -

Micro-Focused IR Thermal Testing with PDR's Focused IR

Jun 20, 2017 -

SCS to Present ‘Using Conformal Coatings to Mitigate System Failures’ during upcoming Webinar

See electronics manufacturing industry news »

The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT news release has been viewed 870 times

  • SMTnet
  • »
  • Industry News
  • »
  • The SMTA Capital Chapter to Host First Meeting of the Year on March 17th at EIT
PCB machines

SMT Custom Nozzles