SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces a New 535-11M-3 UV Cure Adhesive

Engineered Material Systems Introduces a New 535-11M-3 UV Cure Adhesive

Jan 27, 2015

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, is pleased to debut its 535-11M-3 UV cured epoxy.  535-11M-3 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. 

535-11M-3 is an ultra-low stress, lower glass transition temperature version of the 535-10M-1 UV cure adhesive. The material is designed to eliminate any “crowning” (warpage) of sliders in Head Gimbal Assemblies and can be used in other bonding applications in the Head Stack Assembly. The material also can be used for lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

The new non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-11M-3 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony. 

535-11M-3 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the 535-11M-3 UV curing adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 03, 2017 -

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Sep 13, 2017 -

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 10, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Apr 22, 2017 -

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

52 more news from Engineered Materials Systems, Inc. »

Jan 15, 2018 -

SMTA International 2017 Best Papers Announced

Jan 15, 2018 -

Juki Announces Greg Lefebvre as Regional Sales Manager for the Americas

Jan 15, 2018 -

Aegis Software Cited as a Notable Vendor in Two Gartner Reports on Manufacturing Execution Systems

Jan 15, 2018 -

Libra Industries Promotes Daniel McMaster to Manager of Program Management at Dallas Facility

Jan 15, 2018 -

NEO Tech Wins Industry Excellence Award for Most Innovative Service of the Year from One Planet

Jan 13, 2018 -

PACE to Introduce New Low-Cost ADS200 AccuDriveTM Production Soldering Station at IPC Apex Booth #2405

Jan 13, 2018 -

Aegis Software Cited as a Notable Vendor in Two Gartner Reports on Manufacturing Execution Systems

Jan 11, 2018 -

CableEye® HV-Rated QuickMount™ Housing for CAMI Connector Boards, CBH2

Jan 11, 2018 -

Virtual Industries Recognizes Patrick Lemos for 20 Years of Service

Jan 11, 2018 -

Ersa Continues to Grow Support in Mexico with New Field Service Engineer

See electronics manufacturing industry news »

Engineered Material Systems Introduces a New 535-11M-3 UV Cure Adhesive news release has been viewed 563 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces a New 535-11M-3 UV Cure Adhesive
PCB Rework / Repair Services

pcb components vacuum pick up