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Ersa to Show the New SMARTFLOW 2020 and HOTFLOW Systems

Jan 25, 2015

HOTFLOW 3/20.

HOTFLOW 3/20.

SMARTFLOW 2020.

SMARTFLOW 2020.

Kurtz Ersa North America, a leading supplier of electronics production equipment, will exhibit in Booth #2601 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. For the first time, Ersa will display the new Smartflow 2020 selective soldering system and HOTFLOW 3/20 third generation reflow oven.

The Smartflow 2020 selective soldering system requires less than 3 m² of space, thus fitting optimally into cell production environments. In all process steps the automatic Smartflow system uses the same successful and proven Ersa Selective Soldering Technology as the large Ersa VERSAFLOW systems without compromising quality and accuracy. With the Smartflow, ERSA finally closes the gap from its high end Versaflow platform to an entry level machine. Due to its universal pallet fastening, the Smartflow can handle PCB sizes of up to 508 x 508 mm [20” x 20”].

The HOTFLOW 3/20 is based on the proven and proprietary Multijet Ersa heating technology. The R&D of the HOTFLOW series was focused on improved heat transfer via a complete re-design of the process tunnel, reduced energy and N2 consumption, improved cooling, as well as optimized process control. From a productivity versus floor space requirement standpoint, the HOTFLOW sets the industry standard. With dual, triple and now quad track options, it is possible to increase throughput by as much as 400 percent without increasing floor space. Tracks run at their own set speed and at their own PCB width for maximum flexibility.

Ersa also will exhibit the Versaflow3, and the complete range of hand soldering tools including the HR600. For more information about Kurtz Ersa North America, visit www.ersa.com.

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